晶圆

晶圆测试的结果是良率和分bin的map图。

The result of wafer probe is wafer map .

铜互连和金属间低K绝缘层可解决布线RC延迟问题，CMP可解决晶圆表面不平整问题。

The CMP technology solves the problem for non-smooth of wafer surface .

高亮度LED晶圆紫外激光划片技术研究

The Technology Study on UV Laser Dicing High Brightness LED Wafer

晶圆制造、运输、封装过程中Al焊垫污染源的研究

Study on Al Pad Contamination Sources During Wafer Fabrication , Shipping and Assembly

IC制造过程各种工艺前都需要进行晶圆的传输、定位和姿态调整。

Before IC manufacturing processes , wafers need to be transferred , positioned and aligned .

用Extend仿真建模软件建立了有重入特性的晶圆厂仿真模型。

A wafer fab model with " re-entrance " feature was built using extend simulation modeling software .

RFID封装设备中晶圆的识别与定位

Recognition and Alignment Technology of the RFID Wafers

基于多代理的知识有色赋时Petri网的晶圆制造系统建模方法

Modeling technology for semiconductor wafer fabrication system based on Agent-oriented knowledge colored timed Petri net

晶圆片搀杂剂可以在元素周期表的III和v族元素中发现。

Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements .

绿色的“非金属添加工具（metalfreetool）”标志意味着硅晶圆必须得经过这台机器的处理以后，才能去添加铜质电路。

The green " metal free tool " sign indicates that this machine is used in a part of the process prior to the addition of copper circuits .

在IC芯片制造过程中，将排布在硅晶圆上的集成电路切割分离是其中一个重要的工序，目前用于切割分离集成电路的刀具主要是金刚石超薄切割片。

In process of fabricating integrated circuit , a key technique is to separate the integrated circuits on the silicon wafers .

本文建立了单臂组合设备重入加工的Petri网模型，该模型可以描述晶圆重入加工的过程，并且能够分析得到重入加工过程的最优调度，以及分析了控制死锁策略。

In this work , A Petri net model is developed for single-arm cluster tools to describe wafer reentrant process .

基于QFD的代工型晶圆厂生产绩效评价

Evaluation of Production Performance in Foundry Wafer Fabrication Based on QFD

amd剥离出来的globalfoundries，今年也将在美国开设28纳米晶圆厂。

And AMD spinoff , global foundries , will open its US 28nm-capable plant this year .

CMP后的晶圆的测量和评估方法研究

Study on Measurement and Evaluation of Post-CMP

基于Kohonen神经网络的晶圆光刻流程动态调度方法

Dynamic Scheduling of Photolithography Process Based on Kohonen Neural Network

介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。

Introduces wafer bonding process , technical requirements , application choice and Interaction for MEMS , and showing MEMS fabrication technology and application prospects .

这种芯片将在IBM的纽约300毫米晶圆厂使用90纳米工艺生产，专门为安全性和电子商务进行了优化。

Optimized for security and e-commerce applications , the chips will be manufactured at IBM's300-millimeter wafer fabrication plant in East Fishkill , New York , using a90-nanometer process .

半导体晶圆化学镍/金UBM工艺与设备

Electroless Ni / Au UBM Process and Equipment For Semiconductor Wafer

基于DBR理论的半导体晶圆厂生产作业控制

Production Control in Wafer Fabrication Based on DBR Theory

谈300mm晶圆厂洁净室光刻区域环境中NH3和SO2的控制

Discuss the NH_3 and SO_2 Control in 300 mm Foundry Photo Litho Clean Room

根据X射线和其它分析表明，认为这些缺陷与周围环境残余的汽相HF和随后的晶圆表面反应有关。

Based on X-ray and other analyses these defects were found to be related to vapor phase HF remaining in the ambient and subsequently reacting with the wafer surface .

全球晶圆公司同其他高科技公司一起，与哈德逊谷社区学院（HudsonValleyCommunityCollege）紧密合作，该学院拥有一个名为“TEC-SMART”的专门用于半导体相关培训的园区，也坐落于同一片森林区。

Along with other high-tech companies , GlobalFoundries is working closely with Hudson Valley Community College , which has a dedicated semiconductor-training campus , called TEC-SMART , nestled in the same forest .

化学-机械抛光（CMP）-平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。

Chemical-Mechanical Polish ( CMP ) - A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing .

新工厂将继续在300mm晶圆上利用65nm制程生产Cell处理器等。

The new company will continue producing semiconductors on a300 mm wafer line and use a65nm production process .

300mm晶圆芯片制造技术的发展趋势

Developmental trend for processing technology of 300 mm wafer chip manufacturing

清洗结束后，晶圆表面纳米尺度的孔型结构中残留的是异丙醇（IPA）液体。

Isopropyl alcohol ( IPA ) remains inside nano-pore structure on the wafer surface after wafer is cleaned .

300mm晶圆对半导体设备的挑战

The Challenge of Semiconductor Equipment from the 300 mm Wafer

基于eM-Plant的虚拟晶圆制造自动组合装置

Virtual Cluster Tool in Wafer Fabrication Based on eM-Plant

在干燥过程中，氮气环境下置于卡盘中的晶圆通过高速旋转，来加速其表面IPA的蒸发。

And wafers will be put in cassettes under Nitrogen environment to make IPA evaporate by high speed revolution .