整体断裂

当LVL梁受弯曲破坏时，其主要破坏形式为整体断裂破坏、开裂破坏以及混合破坏等3种；

When LVL beams suffer the flexural failure , it has three kinds of primary failure modes , including whole fracture failure , cracking failure and mixed failure .

侧刀箱整体断裂性机体修复

Repairing of the integrally broken body of side tool box

随着切削速度的增大，锯齿形切屑的锯齿化程度先增大，最后基本不变，而剪切带断裂程度不断增大，最后几乎整体断裂。

Along with the increase of cutting speed , the degree of chip aliasing first increases slightly then keeps invariant . The degree of serrated chip fracture in the shear zone is increasing then is almost a whole fracture .

当υ200mm/min时，随着焊接速度的提高，接头断口形貌由存在部分塑性断裂特征变化到完全为脆性断裂特征，但接头整体断裂模式为沿晶+穿晶混合型断裂。

If υ 200 mm / min , the fracture surface pattern changed from brittle fracture with a little ductile fracture to full brittle fracture , and fracture mode of FSW joint remained a mixed-mode of transgranular and intergranular fracture .

因此，准确地预测裂纹转折从而准确地预测裂纹扩展轨迹是整体结构断裂力学研究的一个重点内容。

Therefore , predicting crack turn accurately and predicting the crack propagating trajectory accurately is a important researching content of fracture mechanics for integrally structure .

动态观察了侧壁未熔合缺陷断裂过程，整体接头主要断裂在焊缝和熔合线附近处，侧壁未熔合缺陷是多层多道焊断裂的主要因素。

The course of incomplete fusion fracture was observed dynamically . The entire joint mainly fractured in the weld metal and fusion line nearby .

通过对铸造焊接式整体桥壳断裂事故分析和桥壳疲劳强度计算，提出了桥壳改进设计意见。

Through the diagnosis of fracture failure in one-piece axle housing of welded-castings construction and its fatigue strength calculation , some improvement opinions are offered .

尽管如此，国外的研究经验为我们开展整体机身壁板断裂力学和损伤容限方法研究提供了很好的可供借鉴的基础。

For all that , research experience of the abroad provides important foundation for us in researching the fracture mechanics characteristic and tolerance damage of the integrally fuselage of airplane .

整体锌筒底边断裂原因分析

Analyzing the Reasons Causing the Intergrated Zinc Cans Bottom Breakage

而随着农村现代化进程的推进，中国的乡村文化整体处于一种断裂的状态，出现多种文化元素并存，但又混乱无序的情景。

With the advancement of modernization , the rural culture is in a state of anomie .

试验结果表明，新老混凝土粘结断裂性能明显低于新混凝土整体试件的断裂性能。

The test results show that , the fracture properties of adherence of new and old concrete are evidence lower than the new concrete itself .

焊点阵列排布以及焊点位置也会影响封装整体翘曲和芯片断裂。

An interesting result from the case study of simulations is that the solder ball array and the ball locations would influence the warpage of packaging assembly and the die cracking .