综述了铜在芯片微刻槽中电沉积填充的过程、机理，并着重讨论了实现无裂缝和无空洞理想填充的主要因素&镀液的组成和添加剂的影响。
The procedure and mechanism of copper filling in the trench of the chip are reviewed , the effect of electrolyte components and additives on super filling are discussed .
微刻