球栅阵列封装

按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。

Leaded and lead-free BGA ( ball grid array ) components were tested in board level drop test defined in the JEDEC ( Joint Electron Device Engineering Council ) standard .

近几年出现了一种全新的封装形式：球栅阵列封装（BGA）。

Recently , designers developed a new type of package : ball grid array ( BGA ) package .

球栅阵列封装的应力应变及热失效研究

Study on Stress-Strain and Thermal Failure of Ball Grid Array Package

超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势

Comparison between Ultra-fine Pitch QFPs and BGAs and their Future

球栅阵列封装焊点寿命预测的综合方法

Integrated life prediction method of ball grid array soldered joint

模拟结果表明，无铅球栅阵列封装器件上的应变、应力最大点均发生在焊球分布不均匀处。

Simulation results indicate that the maximum points of the stress and strain are all in the non-uniform distribution part of the lead-free plastic ball grid array device .

在大规模集成芯片中以BGA（球栅阵列）封装的IC芯片被广泛使用。

In large scale integrated chip field , the IC of BGA encapsulation was widely used .

复合球栅阵列CBGA封装器件热循环损伤的有限元模拟

Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array

芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package

应用弹粘塑性有限元法对芯片叠层球栅阵列尺寸封装的焊球，在热循环条件下（-40～125℃）进行了数值模拟，并在此基础上进行了可靠性分析。

Viscoplastic finite-element simulation methodologies were utilized to predict solder joint reliability for a same die size , stacked , chip scale , ball grid array package under accelerated temperature cycling conditions ( - 40 ~ 125 ℃) .

球栅阵列倒装焊封装中的热应变值的测试

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球栅阵列（BGA）封装是一种高密度、面阵列的先进封装技术。

The Ball Grid Array ( BGA ) package is a kind of high density , area array advanced packaging technology .

球栅阵列（BGA）封装能很好地满足IC芯片引脚数越来越多、IC尺寸越来越小的要求，成为新的IC封装技术主流。

The Ball Grid Array ( BGA ) can meet the request that the pin numbers of IC becomes more and more and the size of IC becomes more and more small and becomes the leading method of IC packaging .

为了预测跌落碰撞下球栅阵列（BGA）封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。

In order to predict failure location of BGA lead-free solder joints under a drop impact , ABAQUS software is used to analysis stress distribution of the solder joints .

在微电子封装中，焊锡接点互连不仅用于芯片级的倒装芯片（FC）封装技术，而且广泛用于电路板级封装的球栅阵列（BGA）封装技术。

In microelectronic packaging , solder joints are used not only for chip-level flipchip ( FC ) packaging technology , but also widely used in board-level , ball grid array ( BGA ) packaging technology .

芯片规模封装与球栅阵列（BGA）封装之间的区别变得不可分辨，已成为细间距BGA的同义词。

The term chip scale package ( CSP ) has become synonymous with " fine pitch BGA " as the distinction between a ball grid array ( BGA ) and some chip scale packages become nearly indistinguishable .