化学镀铜

Cu（Ⅱ）-EDTA-HCHO化学镀铜中阴、阳极反应的控制程度

The control Degree of Cathodic and Anodic Reactions is Electroless Copper Plating System of Cu (ⅱ) - EDTA-HCHO

介绍了SiC粉体的敏化、活化及其碱性化学镀铜的工艺配方。

The process formula of sensitization , activation and alkaline electroless copper plating of SiC composite powder were introduced .

SiCp表面化学镀铜工艺研究

Study on the Process of Electroless Copper Plating on SiC_p

CO2激光诱导局域化学镀铜的研究

Experimental study of CO_2 laser induced locally chemical depositions of copper

化学镀铜中Cu（Ⅱ）-EDTA电还原机理

Mechanism of Cu (ⅱ) - EDTA Electroreduction in Electroless Copper Plating

黑碳钢表面超细Al2O3粒子的复合化学镀铜工艺的探讨

Electroless Composite Copper Plating of Al_2O_3 Ultrafine Powders on Carbon Steels

Ti3SiC2陶瓷颗粒表面超声波化学镀铜

Ultrasonic Electroless Copper Plating on the Surface of Ti _3SiC_2 Particles

纳米Al2O3化学镀铜粉杂质对烧结致密化的影响

Influence of impurities on the sintering densification in nano-Al_2O_3 powders coated by copper

均匀设计法在Al2O3粉末超声化学镀铜工艺中的应用

Application of Uniform Design in Electroless Copper Plating on Al_2O_3 Powder under Ultrasonic Irradiation

ABS塑料化学镀铜动力学参数的研究

Research on dynamic parameters of Electroless Cu deposit on ABS plastics

在Ag导电胶上化学镀铜工艺

Electroless Copper Plating Process on the Silver Paste Film

PET塑料化学镀铜

Electroless Copper Plating on PET Plastics

ABS塑料低温快速化学镀铜的研究

Study on electroless copper plating at low temperature and rapid rate for ABS plastic

PCB高稳定性化学镀铜工艺研究

A Study on the Technique of Electroless Cu Deposition on PCB With High Stability

覆盖有ZnO薄膜的玻璃基体上化学镀铜

Electroless Cu Plating of Glass

α-Al2O3陶瓷化学镀铜及化学镀后电镀镍工艺及机理研究

The Technic Principle Research of α - Al_2O_3 Ceramic Chemical Plating with Cu and Electroplating with Ni

纳米Al2O（3p）化学镀铜复合粉末的烧结致密化

Sintering densification of Cu / Al_2O_ ( 3p ) nano-composite powders by electroless copper plating

印刷电路板化学镀铜液回收EDTA的研究

The Recovery of EDTA in Waste PCB Chemical-copper Solution

采用真空蒸发、溅射和化学镀铜的方法分别对研制的PTFE基复合介质进行了金属化处理。

PTFE based dielectric is metallized by vacuum vaporing , vacuum sputtering and chemical plating respectively .

介绍了以次磷酸钠为还原剂、硫酸镍为再活化剂的半导体N型硅表面化学镀铜工艺及其前处理。

A process of electroless copper plating and its pretreatment of semiconductor N-silicon were introduced ,( using ) sodium hypophosphite as reducer and nickel sulfate as re-activation agent .

本论文的目的是对PI（聚酰亚胺）薄膜进行表面改性，使其适合于无钯化学镀铜。

Surface modification of PI film to make it suitable for electroless copper plating-free palladium is the main purpose of the paper .

乙醛酸和葡萄糖用于A3钢酸性化学镀铜工艺研究

Studies on the Technology of Acidic Electroless Copper Plating on Steel Matrix Using Acetaldehyde Acid and Glucose

对早期工艺制备的纳米Al2O（3（P））化学镀铜复合粉体的烧结结果表明，粉末烧结前预处理对粉末烧结具有很大的影响。

The result of sintering Cu-coated nano-Al2O3 ( p ) compounds prepared by the past technics indicated that pretreatment of electroless compounds significantly influenced on the densification properties of compounds .

纳米Al2O3化学镀铜复合粉末具有异常的粉末烧结特性和难于烧结的特点。

It has been found that nano-Al_2O_3 powders coated by copper have abnormal sintering characteristic and are hard to be compacted .

本文以通过在纳米Al2O3颗粒表面化学镀铜的手段，以获得包覆均匀的Cu/Al2O3复合粉体，制备复合性能良好，金属含量可控的金属&陶瓷复合材料为目标。

The objective of this paper is to obtain metal-ceramic composite materials with better complex properties by the way of preparing nano-composite powders of metal and ceramic .

SnO2超细粒子的复合化学镀铜的研究

Composite Chemical Copper Plating of Ultrafine SnO_2 Powder

酒石酸钾钠和EDTA·2Na盐化学镀铜体系

Electroless copper plating system of potassium sodium tartrate and EDTA · 2Na

本论文主要是对PET薄膜进行臭氧处理，然后再接枝以获得较好的亲水性和吸附活性，从而使化学镀铜反应顺利进行。

Ozone treatment and grafting of PET film to achieve good activity which makes the reaction of electroless cooper plating takes place smoothly is the main purpose of the paper .

分析了温度、pH、硫酸镍含量对化学镀铜沉积速率的影响及镀层的表面形貌和结构。

The influences of temperature , pH , nickel sulphate content on deposition rate of copper electroless plating as well as the surface morphology and structure of the deposit were ( analyzed . )

在Cu（Ⅱ）-EDTA-HCHO的化学镀铜液中，阴极过程受电化学步骤或电化学步骤与异相表面化学转化步骤共同控制。

The cathodic reaction process of electroless copper plating in Cu (ⅱ) - EDTA-HCHO solution is controlled by either electrochemical step or by the combination of electrochemical and surface chemical reaction steps .