金属键

用LCBOMO法统一地处理了金属键的两个类型：共轭σ键和共轭π键。

Two types of metallic bond , conjugated σ bond and conjugated π bond , harve been treated by LCBO MO method .

浅谈金属键的能带理论

An elementary introduction to theory of energy band for metallic bond

Blyholder的关于CO金属键合的简单分子轨道描述似有进一步补充和刻画的必要。

Blyholder 's simple molecular orbital description of CO-metal bonding appears to require further refinement .

低温Au-In-Au金属键合及其在VCSELs制作中的应用

Low temperature au-in-au metallic bonding and its application in the fabrication of VCSELs

在富Ti的TiAl合金中加入V，V原子比Al和Ti原子能提供较多的自由电子参与形成金属键，因而提高了合金基体和晶界缺陷处的自由电子密度；

When V are added into Ti-rich TiAl alloy , V atoms will provide more free electrons than both Al and Ti atoms to participate in metallic bonds , thus increasing the electron densities in the bulk and the grain boundary simultaneously .

~（51）VNMR可以作为铁传递蛋白中金属键合的探针

￣( 51 ) VNMR as a Probe of Metal Binding in Transferrin

TiAl合金晶界缺陷的开空间较大，晶界缺陷处的自由电子密度较低，金属键结合力较弱，材料易发生沿晶脆断。

The large open defects occur on the grain boundary in TiAl alloy and the bonding strength of grain boundary is weak due to the low density of free electrons there , and the brittle fracture along grain boundary is prone to occur .

并讨论了Mo&Mo金属键、磁性、稳定性及轨道特性和跃迁谱带之间的关系，计算结果与实测一致，并同SCF-MO计算进行了比较。

A series of formulae correlating the absorbance and Mo Mo distance were obtained . Metal Metal bond , the relationship between the orbital character and the absorbance , magnetic properties and stability of the complexes were discussed . The calculated result was consistent , with the experimental data .

化学键主要有离子键、共价键、金属键。

Chemical bond mainly includes electrovalent bonds , covalent bonds , and metalic bonds .

金属键优选法使得我们可以大大缩小团簇起始几何构形的尝试范围。

The optimum metallic-bond scheme reduces the initial guesses of geometrical coordinates of clusters dramatically .

原子间相互交替施受或互换价电子是金属键合的基本模式。

Metal atoms mutually donating and accepting or exchanging valence electrons are the fundamental modes of metal binding .

金属键合线互连是射频大功率晶体管内匹配技术中的关键手段。

Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor .

SCN-是万能的桥连试剂，它们能与过渡金属键合成多种多样的分子结构。

Thiocyanate ( SCN - ) are versatile bridging agents . Their bonding in transition metal centers has generated varieties of structures .

系统阐述了金属键合的发展概况、基本工艺和方法、表征技术及其在光电器件中的应用。

The metallic bonding technique is summarized generally , including its developing status , fundamental process and methods , characterization and application to the optoelectronic devices .

镀层与基体界面间含氧层的存在，影响电镀层与基体之间金属键的形成，进而影响镀层的结合强度。

The oxidation layer at the coating-substrate interface affects the formation of metallic bonds between the layer and the substrate and hence influences the bonding strength of the coating to the substrate .

在弹性变形阶段原子排列结构不变，而塑性变形阶段此排列结构发生较大变化，包括金属键断裂，原子与空位迁移、重组，晶界变形、迁移等。

When deformation is elastic the initial configuration of atomic system changes little , obvious change is observed in plastic period , such as break of metal bond , movement of atoms and pores , migration of grain boundary .

氮化钛和氮化锆薄膜的结构通常由金属键和共价键混合而成，具有金属晶体和共价晶体的特点：高熔点、高硬度、优异的热和化学惰性，优良的导电性和金属反射比。

Resulting from the exhibition of both metallic and covalent bonding characteristics , the TiN and ZrN films have interesting properties such as high melting points , high hardness , excellent thermal and chemical inert , good conductivity and metallic reflectivity .

结果表明，随着基板硬度的增加，粒子与基板问的主要结合机制由机械结合向金属键合过渡，当基板硬度超过一定值后，难以形成有效结合。

The results indicate that main bonding mechanism between particle and substrate transits from mechanical interlocking to metallic bonding . It is also observed that when substrate hardness is much higher , the Cu alloy particle cannot be effectively deposited onto the substrate .

ⅥB族金属叁键有机化合物的研究进展

Progress in VIB Metal - Metal Triply Bonded Organometallic Compounds

含铁镍金属间键化合物的~（57）Fe穆斯堡尔谱

~ ( 57 ) Fe Mossbauer spectra of a group of compounds containing a iron-nickel bond

从结合能、CO键长、轨道布居、态密度等方面比较了C与金属成键强度及CO分子被活化程度。

The chemisorption properties , including the length of CO bond , orbital population and density of states , are computed and analyzed respectively .

用余氏金属价键理论计算了Fcc基有序Al－Li金属间化合物的键参量和原子间成键的电荷偏移量。

The bonding parameter and charge deviation of Fcc base ordered Al Li intermetallic compounds have been calculated by using metal valence bond theory .

采用激光剥离技术结合金属熔融键合技术将生长在蓝宝石衬底上的GaN外延层转移到Si衬底上。

GaN thin films grown on sapphire substrates are successfully bonded and transferred onto Si receptor substrates using fusion bonding and laser lift-off ( LLO ) technique .

结果表明，EAA能使LDH层间可交换的阴离子碳酸根脱出，且与LDH产生化学键作用形成羧酸金属离子键，减小LDH片层之间的相互作用；

It showed that EAA had released the original interlayer exchangeable carbonate anions of the LDH , and reacted with LDH forming carboxylic acid metal ionic bond .

同时，用类金属的键合作用和金属原子的转移效应较好地解释了非晶态过渡金属（TM）-类金属（M）合金的实验现象。

In the sometime , the mechanism of hybridization of the Fe 3d hand with the metalloid valence orbitals and the electron tranfer between transition metals was used to explain the experimental results for the amorphous transition metals ( TM ) - metalloid ( Met ) alloys .

在Glu-Cu（II）柱上，考察了不同固定方法、不同pH值的铜溶液对键合量及其稳定性的影响，以及固定金属离子键合密度对金属螯合柱配位作用的影响。

As fixing metal ion on the Glu-Cu ( II ) column , the influence of the different fixation methods and different pH values on binding capacity of Cu2 + and stability and the bonded density of immobilized metal ion for the coordination of metal chelate column were examined .

由于固体中多原子相互作用势能函数的建立和原子状态构造原则的提出，Pauling的金属价键理论已发展到一个定量的精确化的水平。

It has been pointed out that Pauling 's valence bond theory of metals has been developed to a quantitative and accurate level due to the establishment of a new potential function with many atom interactions and advance of principles of construction for atomic states in solids .

电负性相关和过渡金属卤化物键能的计算

Electronegativity Corelation for Calculating the Bond Energy of the Transitional Metal Halides

水环境中腐殖质金属离子键合作用研究进展

Binding of metal-ions with humic substances in aquatic environments : A review

本系统采用金属触摸键。

This system adopts metal touch key .