纯铜

纯铜薄板矩形盒拉深特性的试验研究

Study on the Experiment of Drawing Property of Fine Copper Sheet Rectangular Case

指出纯铜薄板的各向异性对矩形盒拉深成形性的影响不十分显著。

It 's pointed out that the effect of the anisotropy of fine copper on the drawing forming property of rectangular case isn 't remarkable .

用X射线衍射仪法测定纯铜点阵常数

Application of X Ray Diffractometer Method Determines the Lattice Constant of Pure Cu

X射线荧光光谱法测定纯铜中微量杂质元素

X-ray fluorescence spectrometry for the determination of trace impurity elements in pure copper

纯铜表面纳米化对Ti离子注入的影响

Influence of surface nanocrystalline of copper on Ti ions implantation

挤压态合金的加工硬化指数n为0.256，明显低于纯铜。

Its strain hardening exponent n is 0.256 , which is obviously lower than that of pure copper .

纯铜和铜合金中杂质元素的ICP分析法

The Determination of Trace Elements in Copper and Copper Alloys by ICP

稀土元素La、Ce在纯铜中的作用机理及高强高导铜合金

The Mechanisms of Rare Earth La 、 Ce on Pure Copper and High Strength and High Copper Alloys

纯铜深层渗铝内氧化Al2O3/Cu复合材料的制备工艺及性能研究

The Preparation Techniques and Capabilities of the Al_2O_3 / Cu Composite Material by Internal Oxidation of Deeply Aluminized Pure Copper Matrix

用X射线衍射仪法对光谱纯铜进行了点阵常数的精确测定，给出了测定值。

In this paper , we apply X ray diffractometer method to determine the crystal space lattice constant of spectrum pure metallic copper Cu accurately .

纯铜、纯镍中磷的ICP-MS法测定

Determination of Phosphorus in pure copper or pure nickel by ICP-MS

文章介绍了WC弥散强化铜的制备过程，通过比较WC弥散强化铜和纯铜的有关性能（硬度、电阻率、密度），指出WC弥散强化铜是一种有潜力的强化铜。

The process of manufacturing WC dispersion strengthened copper ( DSC ) was introduced by mechanical alloying .

叠轧无氧纯铜制备超细晶材料的EBSD分析

EBSD Analysis on Preparation Ultrafine-Grained Materials with Oxygen-Free Copper by ARB

cp/εn实验值的均方根偏离为±3.3%、然后用本方法对纯铜试样的比热进行了测试，并与文献所载作了比较。

The average square root deviation of experimental value of Cp / en is + 3.3 % . The specific heat of pure copper had been measured by this method and compared with literature .

研究了纯铜表面Au/纳米SiC颗粒复合镀层的制备工艺，特别是镀液中SiC悬浮量及阴极电流密度对复合共沉积的影响。

The electroplating process of Au / nano-SiC composite coatings was studied , especially the effects of nano-SiC concentration of electrolyte and cathode current density on codeposition .

硝酸镧共沉淀ICP-AES法测定纯铜中砷、铋、铁、锰、铅、锑

ICP-AES determination of arsenic 、 bismuth 、 iron 、 manganese 、 lead 、 stibium in pure copper by coprecipitation with lanthanum nitrate

ECAP条件下纯铜应变行为的等效应变规律及变形均匀性

The equivalent strain pattern and deformation uniformity of strain behavior of pure copper in case of ECAP

在一定温度下的水溶液中，以硫酸铜为前驱体，抗坏血酸（Vc）为还原剂，加入适量修饰剂，进行了粒径、形貌可控的纯铜纳米粒子的合成。

Size-and shape-controlled phase pure Cu nanoparticles were hydrothermally synthesized from copper sulfate pentahydrate with ascorbic acid as reductant and surfactants as modifiers at a low temperature in aqueous solution .

正如Tammy所说，便士看上去像纯铜的。

As Tammy implied , the penny looks like it 's solid copper .

以MoF6和H2为原料，采用化学气相沉积法在纯铜基体上沉积出难熔金属钼膜层。分析研究了沉积层的组织、结构和硬度。

Molybdenum coating is deposited on copper substrates from the mixture of MoF_6 and H_2 . The microstructures and microhardness of the deposits are analyzed .

本文选用高强度、高模量的连续碳纤维作为增强相，与纯铜基体进行复合，试图获得高强度高导电的连续碳纤维增强铜基复合材料（Cf／Cu）。

In this thesis continuous fibers with high strength and high module was compounded with copper matrix to acquire continuous carbon fibers reinforced copper matrix composite ( Cf / Cu ) with high strength and high conductivity .

利用合金化方法，并借助金相、SEM等测试分析手段研究了Ni/Si，Mn/NiSi和Ti对纯铜显微组织、力学性能和导电性能的影响。

Microstructure , mechanical properties and electrical conductivity of copper based alloys with additions of Ni / Si , Mn / NiSi , and Ti have been investigated by optical microscope and scanning electron microscope .

纯铜表面Al-Ni基自熔合金粉末共渗研究

Multielement Penetration of Al and Ni-based Self-fusion Alloy Powder on the Surface of Pure Copper

用浓HNO3溶解高纯铜试样，电感耦合等离子体发射光谱（ICP-AES）测定其中微量磷，并对试样处理、测试方法、提高灵敏度等条件进行了优化实验。

The micro amounts of phosphorus in electroplate copper dissolved with HNO 3 were determined by ICP-AES under the optimized experimental conditions .

本课题采用真空热压扩散焊接（VacuumHotPressingDiffusionWelding），简称VHP来实现工业纯钛和工业纯铜的扩散连接。

In this thesis , using the vacuum hot pressing diffusion welding ( Vacuum Hot Pressing Diffusion Welding ), which is called VHP for short , can achieve the bonding of industrially pure titanium and pure copper .

以中间合金的方式在纯铜中加入不同量稀土元素La和Ce，机械加工成统一尺寸试样后，测试其导电性、强度和硬度。

By means of inter-alloy , added different amount of rare-earth elements La and Ce to pure copper . It is tested that conductance , intensity and hardness after machining the sample with uniform size .

在纯铜中加入Zn和稀土元素La，通过双电桥测试电阻、拉伸和硬度实验及金相组织观察，研究不同含量的Zn和稀土La对铜的导电性、抗拉强度、硬度、金相组织的影响。

The conductivity , strength and hardness of the copper material with addition of the metal Zn and rare-earth element La are investigated by electricity resistance measurement with double bridge circuit , tensile test and hardness measurement .

研究结果表明，在纯铜中加入少量细小、弥散、热稳定性好的Al2O3颗粒，在目前的实验条件下，具有非常好的组织结构稳定性，并能有效地抵抗住快速离子的辐照。

The results show that the addition of a small quantity of finely dispersed and thermodynamically stable particles of A_2O_3 in pure copper leads to a good microstructural stability against the fast ion irradiation effectively at present test conditions .

结果表明：在纯铜中添加微量Al（1%～2%），Sn（0.5%～2.5%）元素可抑制其在室温下动海水中的腐蚀。

Experimental results show that the addition of Al ( 1 % ~ 2 % ) or Sn ( 0.5 % ~ 2.5 % ) to copper alloys inhibited their corrosion in stirred sea water at normal temperature .

通过在纯铜中添加Sn、Zn元素铸造试样，采用阳极极化测定法研究在弱酸（pH值为6）、弱碱性（pH值为8）溶液中Sn、Zn两元素对铜合金腐蚀行为的影响。

To determine the influence of tin , zinc on the corrosion behavior of copper alloys in the weak acid ( pH6 ) and weak basic ( pH8 ) solutions , the method of anodic polarization test was adopted .