微细加工

本文讨论了用激光对陶瓷零件表面作微细加工的一些基本问题：余量去除、已加工表面完整性和尺寸精度等。

Some basic aspects involved in laser micro machining of ceramics like material removal , surface integrity and dimensional precision are discussed .

超声加工工艺在加工硬脆材料方面的独特优势，使其在微细加工领域占有一席之地。

Because of the characteristic of USM ( Ultrasonic Machining ), it is fitter for processing these materials in micro machining field .

介绍了一种通过微细加工技术即二次X射线曝光制作凹面光栅的方法。

The technique of fabricating concave gratings in PMMA by double X-ray exposures is described .

用激光微细加工制作平面型InGaAs/InPPIN光探测器

Fabrication of planar InGaAs / InP PIN photodiodes using laser assisted microprocessing

微机械（MEMS）与微细加工技术

The new development of MEMS and micro-machining

微机电系统（MEMS）的发展，带动了微细加工技术的发展。

With the development of the Micro Electro Mechanical System ( MEMS ), mico-machining technologies grows rapidly .

STM脉冲电压极性对材料微细加工影响的研究

Influence of Pulse Polarity on Nano-Machining of Scanning Tunneling Microscope

通过离子束技术和微细加工技术可以实现DLC薄膜的图形化并能大大提高薄膜的场发射性能。

A patterned DLC thin film cathode was fabricated by reactive-ion etching method and mic ro-fabrication technology .

本文报道&台自制的光学投影亚微米量级微细加工用的KrF准分子激光振荡-放大系统，并对其设计和运转性能加以讨论。

A KrF resonator-amplifier excimer laser system using for submicro fine processing was reported .

MEMS技术将是21世纪科技与产业的制高点之一，而微细加工技术又是MEMS发展的重要基础。

MEMS technology is a hot spot of science and industry in the 21st century , and micro fabrication technologies are the key problems of MEMS development .

采用微细加工技术研制压控振荡器用BST薄膜变容管。

The BST thin films varactor used in voltage-controlled oscillator were fabricated using micro-fabricated techniques in this paper .

文章综述了用于制备MEMS器件的几种典型微细加工技术的工艺原理、特点以及研究现状，并展望了这些微细加工技术的发展前景。

The principle of process , characteristic and research status on the several typical microfabrication techniques used to fabricate MEMS devices are given a review in this paper .

微机电系统技术（MEMS）是随着半导体集成电路微细加工技术和超精密机械加工技术的发展而发展起来的。

Micro-Electro-Mechanical System ( briefly named MEMS ) has grown up along with the development of semiconductor 's integrate circuit minuteness machine technology and exceed exactitude machine process technology .

根据模拟结果，采用SOI硅片和微细加工DRIE技术制作了这种V型梁微执行器并联阵列。

Based on the result of simulation , the V-shaped beam thermal micro-actuator array is fabricated on a SOI wafer by DRIE .

LIGA技术是近年来才开展起来的一门新技术，是微细加工的一种较理想新方法。

LIGA technology is a new perfect means for micro fabrication , which is developed in recent years .

微细加工技术作为MEMS技术从设计到产品化的整个过程中最关键和基础的环节，已成为当前MEMS技术研究的热点。

Micro-fabrication technology is the most basic and crucial step of the MEMS technology , from designing to production . It has become one of the hotspots in present MEMS research .

软X射线聚焦波带片的研制包括光路设计、膜系设计、衬底选择、薄膜制备、亚微米光刻、X射线光刻、反应离子刻蚀、离子束刻蚀、电镀和化学腐蚀等多种微细加工技术。

The development of soft X-ray CZP included design of optical path , selection of material , preparation of thin film , sub-micron lithography , X-ray lithography , reactive ion etching , ion beam etching , electroplating and chemical etching .

采用先进的LPE及反应离子刻蚀等微细加工技术制作了盘型－图钉式微腔结构，测得其有源区的光荧光谱的半宽度为0.032eV，波长为815.33nm。

The measured half width of photoluminescence spectrum in the active area is 0.032 eV with the wavelength of 815.33 nm .

目前，碳氟等离子体被广泛用在器件的微细加工过程中，如沉积低介电常数的氟化非晶碳薄膜，刻蚀SiO2、Si以及其它相关材料。

Nowadays , in the manufacturing of microelectronic components fluorocarbon plasma was widely used in low K a-C : F : H film deposition and the etching of SiO_2 , Si and other related materials .

而随着微机械技术的发展，微细加工技术更加多样，MEMS基片的结构将更加复杂，因此探索一种新的能够满足要求的测量方法势在必行。

Along with the development of Micro Electrical Mechanical System ( MEMS ) technology , the MEMS manufacture technology will take on diversification , and the structure of MEMS chip will become more and more complex .

DNA序列分析及配套技术的研究不仅是一门科学，更是一项高科技产业，它涉及微细加工、高分子科学、分析化学、生物工程、光学工程等多个学科领域。

Studies on DNA sequence analysis and its correlative technologies are not only a scientific branch , but also a high technology industry , which covers multi-disciplines such as microfabrication , polymer science , analytical chemistry , biological engineering , optical engineering and so on .

单片OEICs的激光微细加工技术研究

Study on Laser Assisted Microprocessing for Fabrication of Monolithic OEICs

本文介绍了微细加工的一般技术，介绍了种类型的调节腔长的F-P滤波器，介绍了F-P滤波器在传感器领域的应用。

Conventional micro fabrication technology was introduced first , and then some kinds of cavity length tunable F-P filter was introduced , next was it 's usages in sensor systems .

本论文基于硅基微细加工技术，按照硅基MEMS微型传感器的器件结构，利用现有设备条件，对表面牺牲层MEMS工艺以及体硅MEMS工艺中部分关键技术进行工艺摸索。

This thesis based on micro fabrication technology , according to the structure of silicon based MEMS micro sensor device , utilized equipment in existence developed and optimized a few key processes of MEMS sacrificial-layer process and MEMS bulk process based on silicon .

微细加工技术已成为克服MEMS技术局限的重要技术，具有高效率、高柔性、能加工复杂三维形状和多种材料的特点，已成为非常活跃的研究热点。

With the characteristics of high efficiency , high flexibility and capability of machining complicated three-dimensional parts in a wide range of materials , micro-machining Technology has become a very important means against the limitation in MEMS and become the most active and hot research subject .

采用了光刻、电镀、溅射等微细加工工艺制造了MGELR的定子。

The micromachining process like photolithograph , electroplate and sputtering etc is adopted to fabricate the stator of MGELR .

LIGA技术具有加工精度高，深宽比大，表面平整，应用领域广等优点，是一种先进的微细加工方法。

High processing precision , high aspect ratio and great structural height are the most outstanding advantages of LIGA process , which is a kind of advanced process used in MEMS ( Micro electron mechanical systems ) .

球面调制靶的制备技术是ICF研究的重要组成部分之一，其关键难点集中在对空心玻璃微球（HGM）外表面生成预定的扰动条纹的微细加工。

Manufacturing technology of micro-spheres perturbation target is an important part of ICF research , the key difficulty is micro-machining on the surface of a HGM ( Hollow Glass Micro-spheres ) and engendering scheduled perturbing stripe .

在激光微细加工中，激光曝光区的温度对激光诱导扩散生成p-n结的结深、杂质浓度的分布和激光辅助合金生成欧姆接触的接触电阻等具有决定性影响，必须准确测定。

In laser assisted microprocessing , the temperature of the spot irradiated by laser has a tremendous impact on the distribution of impurity concentration , the depth of p-n junction , the resistance of ohm contact and so on .

论述了微电子机械制造中的主要技术，包括表面微细加工、体微细加工、光刻-电铸-注塑（LIGA）、硅直接键合技术等，并讨论了这些新技术在MEMS产品中的应用前景。

Some new technologies of micro-mechanism manufacture are discussed , such as microfabrication technology for surface / bulk , LIGA and silicon direct bonding technologies and so on . Besides , the application foreground in MEMS products using these new technologies is also expounded .