导热胶

测试了颗粒吸附剂（沸石／聚苯胺复合物）、成型吸附剂与铜表面之间的接触热阻以及导热胶对吸附剂与铜表面之间的接触热阻的影响。

The contact resistance between granular adsorbent ( zeolite / polyaniline composite ) and copper surface , and between shaped adsorbent and copper surface has been tested . Moreover , the effect of heat conduction glue on the contact resistance between adsorbent and copper surface has been tested .

结果表明，成型吸附剂能有效地强化吸附剂与铜表面之间的传热，导热胶能进一步强化吸附剂与铜表面之间的传热。

The results indicate that the shaped adsorbent can effectively enhance the heat transfer between adsorbent and copper surface , and that the heat conduction glue can further enhance the heat transfer between adsorbent and copper surface .

当在导热胶中加入一定量MgO后，粘结强度得到很大提高。

When adding some MgO particles into the adhesive , the tensile shear strength can be improved greatly .

研究了BN在水玻璃溶液中的分散稳定性，通过XRD和FTIR研究固化后水玻璃基导热胶的成分变化。

This paper investigates the dispersion stability of BN in water glass and the composition of cured adhesives by XRD and FTIR .

试验结果分析认为BN填充的水玻璃基导热胶具有热导率高、稳定好、成本低的优点，可以满足大功率LED封装散热的要求，具有一定的应用前景。

K. The water glass based adhesive has high thermal conductivity , stability and low cost advantages . Water glass adhesive can meet the heat dissipation requirements of LED packaging and has a certain applied prospects .

在确定的粘度和固化工艺条件下，对导热胶进行了导热系数和热稳定性测试，结果表明，改性之后的BN纳米球都使导热胶的导热性和热稳定性得到了提高。

Under the conditions of determined viscosity and curing process , the thermal conductivity and thermal stability of thermal adhesive were tested . It showed that the BN nanospheres modified by PVP or EDTA-2Na can increase thermal conductivity and thermal stability of the thermal adhesive .

吸附器中导热胶热传导系数的研究

The Research of Heat Conduct Glue Used for Heat-exchang Adsorber

通过对配制胶粘剂介电强度的测定，发现该类导热胶介电强度较低，这主要由水玻璃基体的介电性能决定。

The experimental results show that this kind of adhesive has low dielectric strength , which is mainly dependent on the dielectric properties of the water glass .

传统的热界面材料如导热胶、合金钎料的导热性能较低，已成为封装中制约热量传导的瓶颈。

The heat-conducting property of traditional thermal interface materials such as thermally conductive adhesive and solder have not been competent , so that they have restricted the heat dissipation .

纳米AlN/EP导热绝缘胶的制备及其性能研究

Study on preparation and properties of Nano-AlN / EP thermally conductive insulating adhesive

试验发现导热绝缘胶的导热系数随着固化温度升高而降低，绍尔硬度随着固化温度的升高而升高。

It is found that the thermal conductivity decreased and the shoreA hardness increased with the curing temperature increased .

试验中发现，在相同的试验条件下，各填料的导热绝缘胶的导热系数由高到低的排序为：氮化铝氧化铝氧化锌。

It is found that the descending sequence of thermal conductivity of thermal insulate adhesive with different fillers is AlN , Al2O3 , ZnO in same conditions .

导热灌封胶，硅胶，电子用硅胶，极高的导热性和绝缘性，优秀的高温运用范围，UL94V-0认证，能满足电子机械和航天、航空工业的需要。

Extremely highly thermal conductivity and dielectric strength , excellent for high temperature , has a UL Flame Rating of94V-0 , useful in electric , mechanical and airborne , aerospace industry .