半固化片

半固化片的基础知识

The Foundation Knowledge of Prepreg

半固化片表面质量分析

Quality Analysis of Prepreg Surface

介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料，用于生产低到高层数的PTFE多层板的情况。

This article describes the different types of applications , bonding films , equipment needs , and bonding methods used to produce low-count and high-count PTFE multiplayer boards .

综述了采用低成本的常规FR-4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板，它具有较低的信号串扰和较低的成本。

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost .

以上所有产品都可生产可激光钻孔半固化片和耐阳离子迁移产品；

All the products listed above are compatible with RoHS directive and SONY SS-00259 standard .

低介电高频覆铜板及半固化片基材研制与开发

The research and development of low dielectric constan and high frequency copper clad laminates ( CLL ) and prepregs

覆铜板用环氧玻璃纤维布含浸性改善一无气泡7628半固化片生产方法

Improving the Wetting Property of Epoxy Resin Glass Fabrics Used in CCL & The Method of Producing Non-bubble 7628 Prepreg

以玻璃纤维为增强材料，改性树脂为基体树脂，丙酮为主要溶剂，通过试验及分析确定了最佳的树脂配方体系，制备了贮存稳定性优良的胶液和半固化片。

Using the modified resin system as matrix , glass fiber as reinforcement , and acetone as main solvent , the impregnant and half cured sheet with fine properties were prepared according to experiment and analysis results .