化学层

  • 网络Chemical layer;chemosphere
化学层化学层
  1. 结果表明,镁合金化学镀镍层的P含量为6.68%(质量分数),与基体结合良好。

    The results showed that phosphorus content of electroless coating was 6.68 % wt , and the films ' adhesion resistance was good .

  2. SiCp/Al复合材料与化学镀镍层结合机理研究

    Study on Adhesion Mechanism of SiC_p / Al Composites and Electroless Nickel Coating

  3. 结果表明,在化学镀镍层中存在薄的吸附层,它由C、Cl、O、S等组成,主要的吸附物是C和O。

    The experimental results showed that there was a thin adsorption layer consisting of C , S and Cl.

  4. SiCp/Al复合材料表面化学镀镍层的结构及性能研究

    Study on structure and properties of electroless nickel plating on SiC_p / Al composite

  5. 化学镀镍层与Si3N4陶瓷的界面反应

    The Interface Reaction of Chemical Ni-plating Layer and Si_3N_4 Ceramic Substrate

  6. 利用SEM观察了活化膜和预化学镀镍层的表面形貌。

    The morphology of activation film and pre-electroless Ni coating was analyzed by scanning electron microscope ( SEM ) .

  7. 稀土元素La、Nd和Eu对化学镀镍层结构与性能的影响

    The Effect of La , Nd and Eu Rare Earth on the Structure and Performance of Ni-P Coating

  8. 并且化学偶联层的分子结构对FRP的增强也密切有关,当偶联层分子参与树脂固化能与树脂大分子发生化学反应时,其增强效果显著。

    Again it was discovered that the reinforcing effect is related with the molecular structure of the chemical coupling layer .

  9. 探讨了用镍/铜胶体处理印制板时温度、时间和pH的影响,测定了化学镀镍层的剥离强度。

    The influences of temperature , time and pH on the process of PCB by using Ni / Cu colloid catalyst were discussed , and the peeling strength of nickel deposit was tested .

  10. 但是激光处理后的PI薄膜和激光等离子联合处理后的PI薄膜化学镀铜层的结合力差,在水中清洗时已有部分脱落。

    But the films treated by laser treatment and combined treatment using laser and plasma had poor binding force with electroless copper plating layer , and had been partly off washed by water .

  11. 采用薄片弯曲法测量不同pH值和不同热处理对化学镀镍层内应力的影响,分析了产生变化的原因。

    The effects of different pH values and heat treatment temperatures on the internal stress of Ni-P coating deposited from electroless plating are measured quantitatively by thin film flexural method , and the reasons for the changes are analyzed .

  12. 研究结果表明,在本文提出的前处理工艺下所获得的化学镀镍层与文献中的前处理工艺下获得的镀层的硬度、耐蚀性相当,但此工艺不含高污染物CrO3和HF。

    The results showed that rigidity and corrosion resistance of EN deposit following new pretreatment proposed in the dissertation was almost the same as that of deposit following pretreatment mentioned in literatures .

  13. 化学镀镍层封孔新工艺的研究

    Study of a new process for blocking of electroless nickel deposits

  14. 光亮剂对化学镀镍层性能及结构的影响

    Effect of Brighteners on Structure and Performance of Electroless Nickel Coatings

  15. 铝上化学镀镍层耐蚀性研究

    Study of The Corrosion Resistance of Electroless Ni-P Coating On Aluminium Alloy

  16. 提高压铸铝外壳化学镀镍层质量工艺

    Technics for improving die-cast aluminum case electroless nickel coating quality

  17. 几种添加剂对陶瓷化学镀铜层性能的影响

    Influences of Several Additives on Performance of Electroless Copper Coating on Ceramics

  18. 化学镀镍层抗氧化性的电化学研究

    Study of the Antioxidation Behavior of Electroless Nickel Coating by Electrochemical Method

  19. 低磷化学镀镍层的组成和结构

    Composition and structure of the low phosphorous electroless nickel coating

  20. 对化学镀镍层性能、学镀镍的工艺技术及应用范围和前景进行了分析。

    Its performance , technology , application range and prospect are analyzed .

  21. 研究了化学镀镍层上镀硬铬工艺。

    Process of hard Cr plating on electroless Ni coatings was investigated .

  22. 镁合金化学镀镍层的结合机理

    Adhesion mechanism of direct electroless nickel coating on Magnesium Alloys

  23. 工艺因素对化学镀锡层成分的影响

    Study on Effect of Process Factors on Components of Electroless Tin Coating

  24. 低温超声波化学镀镍层的组织结构与性能

    Microstructures and properties of low temperature ultrasonic electroless Ni coatings

  25. 化学镀镍层中磷含量的快速测定

    Rapid Determination of Phosphorus Content in Electroless Ni-P Coating

  26. 溶液老化对化学镀镍层耐蚀性的影响

    The effect of solution age upon the corrosion resistance of electroless nickel deposits

  27. 不同类型化学镀镍层耐磨性的研究

    Abrasivity study of different types of electroless nickel deposits

  28. 化学镀锡层结构及性能研究

    Studies on structure and properties of electroless tin deposit

  29. 分光光度法测定化学镀镍层中的镍和磷

    Measurement of the composition of chemical deposition Ni - P alloy by spectrophotomete

  30. 化学镀铜层的表面处理

    Study on Surface Treatment of Electroless Copper Plating Film