电镀镍

贮氢合金粉末表面电镀镍工艺

Process Study of Electroplating Nickel on the Hydrogen-Storage Alloys Powder Surface

电镀镍/金生产管理实战

Production Management of the Plated Nickel / Gold

提出深孔、盲孔零件如电池壳等电镀镍工艺及镀液配方，研制成功BH光亮剂和BH深镀剂。

A new bright nickel plating process and itS solution is provided for battery cases or partS with deep and blind holes .

飞机零件氨基磺酸盐电镀镍修复工艺

Technology of Nickel Electroplating in Sulphamate Bath for Repair of Airplane Parts

研究了一种镁合金表面直接电镀镍的新工艺。

A new process of direct electroplating on magnesium alloys was studied .

高速电镀镍的应用

Application of High Speed Plating - Watt Bath high speed Nickel Plating

电镀镍污泥氨浸出工艺中氨回收的技术

Technology of Reclaiming Ammonia in Process of Extraction Nickel from Electroplated Nickel Mud

碳纤维电镀镍的研究

Factor Study on Electroplating of Carbon Fibre with Nickel

电镀镍－钨非晶态合金初探

Preliminary Investigation on Amorphous Ni - W Alloy Electroplating

镁及镁合金表面电镀镍工艺的研究

Nickel Electroplating Technology on Magnesium and Its Alloy

电镀镍组合添加剂研究

Study of Compound Additives for Nickel Electroplating

运用正交试验确定了连续电镀镍的最佳工艺条件。

The optimal technics conditions for continuous nickel electropating have been determined by orthogonal experiments .

电镀镍-磷合金的研究进展

Research Progress in Electroplated Nickel-phosphorus Alloy

允许对校准块表面镀铬或无电镀镍。

It is permissible to chromium plate or electroless nickel plate the surfaces of the block .

通过采用无电镀镍工艺成功地实现了在硅纳米线表面镀镍。

Plating nickel on surface of silicon nanowires was was implemented successfully by the electroless nickel process .

氨基磺酸盐电镀镍工艺镀层内应力小、沉积速度快，且具有较好的结合力，可以很好地应用于飞机零件维修。

Thus sulphamate electroplating technology was used to prepare nickel coating for the repair of the airplane parts .

电镀镍漂洗过程中会产生大量含镍废水。

A large number of nickel-containing waste water will be produced during the process of nickel plating rinse .

为提高电镀镍的沉积速率以提高劳动生产率，采用自行研制的离心高速电镀镍装置。

Self-designed centrifugal high-speed chromium plating device was adopted to raise deposition rate for inner surface of cylindric works .

结果表明：镁合金表面经脉冲电流法预镀镍后，表面形成了稳定的薄层镍镀层，可为后续电镀镍合金提供性能良好的镀层基底；

The results showed that the substrate coating with good property could be prepared by preliminary electroplating nickel using pulse current .

简述了电镀镍/金焊接过程中拉脱强度不足现象，分析了导致拉脱强度不足的电镀过程中和焊接过程中可能存在的影响因素。

This paper describes the phenomena of the deficiency of soldering intension of electrolyte nickel / gold , and analyzes the factors which affect the solderability .

通过试验，我们确定了分散电镀镍的工艺参数、合适的辅助阳极和纺杯镀件的悬挂方式。

The technological parameters for the dispersed nickel plating are fixed experimentally , the suitable supplementary anode selected , and the optimum ways to hang the plating specimens determined .

用于MEMS的单晶硅上无电镀铜、镀镍工艺

Electroless Copper and Nickel Plating on Single-Crystal Silicon for MEMS Applications