厚膜浆料

目前晶体硅太阳电池生产中常见的金属化工艺为厚膜浆料丝网印刷和烧结工艺。

Currently , the typical commercially metallization method is screen printing and sintering thick film paste for front side and back side of solar cell .

反应粘结因导热性和热应力等方面的优势，使其成为AlN基板厚膜浆料粘结的重要方式。

Reaction-bonding method will be an important method of bonding in thick film paste for AlN substrate .

介绍了AlN基片所用厚膜浆料的产品性能。从金属粉体的制备，粘结方式探索和烧结工艺的改进等方面综述了该领域的研究进展。

The performance of thick film paste for AlN substrate was summarized , relating to manufacture of metallic powder , study of bonding manner and improvement on firing process .

用液相结晶和高温分解法制备偏离化学计量比的二氧化锡材料，对此二氧化锡进行掺杂，制成由一定原料配方组成的厚膜浆料，以此浆料用丝网印刷技术制备SnO2厚膜气敏元件。

The Special SnO 2 materials were prepared in chemical method . By doping Pb , these SnO 2 mixed with other materials made the mixture for thick film .

金属化工艺主要涉及网版、厚膜浆料、印刷和烧结。

Metallization technology mainly involves halftone , thick film paste printing and sintering .

厚膜浆料的物化特性与厚膜电阻力敏特性的关系

The Dependence of Strain Characteristic on Physical and Chemical Properties of Thick Film Paste

陶瓷基板的表面张力和厚膜浆料对基板的润湿度会影响印刷线条的分辨率。

The influence of surface energies of ceramic substrates an line resolution in screen printing was studied in this article .

模拟厚膜浆料的烘干曲线进行实验，对乙基纤维素为增稠剂的载体系列的挥发特性进行了研究，比较了不同溶剂对载体挥发特性的影响。

The drying curve of the thick film resistance paste was simulated . The effects of different solvents on carrier were investigated .

主要工作职责：负责厚膜浆料产品的产品研发，本地化，工艺改进，及浆料工艺方法改进。

PRIMARY FUNCTION OF POSITION : Responsible for the product modification and localization of thick film materials , formula and process developing .

适当时间的超声分散可以有效地减少浆料的团聚现象，从而改善了厚膜浆料的分散性和均匀性。

The conglobation phenomenon of Slurry was decreased by supersonic dispersing for a right of time , thus the dispersivity and the uniformity of thick film slurry were improved .

贵金属粉体由于其优良的电学性能和化学稳定性，其作为厚膜浆料的功能相粒子在电子工业领域有着十分广泛的应用。

Precious metal powders have a very wide range of applications in electronic industry as a function phase in thick film due to their excellent electrical properties and chemical stability .

随着微电子工业的发展，对厚膜浆料也相应提出了更高的要求，其导电功能填料由单一贵金属粉末向复合化、梯度化等功能性粉末方面发展。

Along with the development of the micro - electronics industry , thick film serum is correspondingly more highly requested , and its conductive functional stuffing is developed from simple noble metals powder to composite gradable functional powder .

新型BaPb（1-x）BixO3厚膜电阻浆料的研究

Study on BaPb_ ( 1-x ) Bi_xO_e Thick-film Resistor Pastes

厚膜电阻浆料用有机载体挥发特性研究

Study on Volatility of Organic Carrier in Thick Film Resistance Paste

国内厚膜电子浆料的发展与应用

Development and application of electronic thick film paste in China

BaPbO3/Ag复合体系大功率厚膜电阻浆料的研究

Study on BaPbO_3 / Ag Based High-power Thick Film Pastes

环保型厚膜导体浆料的开发

The Development of Environment-friendly Thick Film Conductor Paste

大功率厚膜电阻浆料的研究

Study on High-power Thick-film Resistor Pastes

通过测量丝网印刷后膜层的表面粗糙度来表征厚膜电子浆料的流平性，研究了常用表面活性剂司班85及卵磷脂含量对浆料流平性的影响。

Effects of surfactant on the leveling of thick-film paste were investigated by measuring the surface roughness of screen-printing film .

环保型厚膜导体浆料，采用化学法制超细钯银合金粉作功能相，合金化完全，平均粒度0.1μm，比表面积10m2/g；

Environment-friendly thick film conductor paste adopts ultrafine Pd-Ag alloy powder made by chemical methods as functional phase . Alloying is complete . Average grain is 0.1 μ m and specific surface area is 10m2 / g.

AlN陶瓷厚膜金属化浆料用玻璃体系的制备和研究

Study on the Preparation of Glass Frit Used in Thick-Film Paste for AIN Metallization

本课题利用钌系厚膜热敏电阻浆料，在96%wt的Al2O3的陶瓷基板上成功地制作出热敏电阻器。

In this thesis , thick film thermosensor is firstly fabricated on 96 % wt Al2O3 ceramic substrate successfully by laser micro-cladding thick film paste of the thermosensor .

概括介绍了厚膜金导体浆料。

Thick-film gold conductor pastes are summarized in this paper .

厚膜铂电阻浆料烧结过程微观结构分析

Microstructure Analysis of Thick Film Platinum Resistance Paste during Sintering

热处理温度对Mn－Co－Ni厚膜热敏电阻浆料特性的影响

Effect of Heat-Treatment Temperature of Mn-Co-Ni system Thick-Film Thermistor Paste on Its Properties

厚膜浪涌电阻浆料研究

Study of the Ink for Thick Film Surge Resistors

应用于氧化铝共烧基板的厚膜钨导体浆料

Thick - Film Tungsten Conductor Paste Applied in HIC

厚膜镍导电浆料研究

Study on Thick-film Nickel Conductive Paste

多孔硅表面氧化钒热敏电阻薄膜的阻温特性系列化厚膜PTC热敏电阻浆料的研制

Study on Series of the Thick-Film PTC Thermal Paste

不锈钢基厚膜PTC热敏电阻浆料的制备与性能研究

Synthesis and Properties of Thick Film PTC Thermistor Paste on Stainless Steel Substrate