厚膜集成电路

行星夹具膜厚均匀性计算厚膜集成电路

Film uniformity calculation of large caliber coating machine the thick film integrated circuit

集成电路有厚膜集成电路和薄膜集成电路。

The integrated circuit contain thick film integrated circuit and the thin film integrated circuits .

详细分析了以ASCII码存储的ProtelPCB版图文件的存储格式和图元数据结构，并基于Protel版图文件接口，实现了应用于厚膜集成电路制造的激光微细熔覆柔性布线CAD/CAM系统开发。

The file store format and element data structure in Protel PCB FILE 6 are described in this paper , and its potential application in designing and manufacturing thick film integrated circuit board based on laser micro cladding technique is given .

壁厚型3例；厚膜集成电路

Thickened wall 3 cases ; The Thick Film Integrated Circuit

厚膜集成电路网印应注意的技术问题

Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits

浅谈厚膜集成电路基板印刷的质量控制

A Brief Talk on Quality Control of Thick Film Integrated Circuit Substrate Printing

GB/T14619-1993厚膜集成电路用氧化铝陶瓷基片

Alumina ceramic substrates for thick film integrated circuits

但早期的工作的主要目标是设计与制作双极型高温器件和厚膜集成电路。

The early work took aim to design and manufacture high-temperature bipolar devices and thick film ICs .

由于半桥式电路比全桥式电路少用两只功率开关管和驱动厚膜集成电路，在几千瓦到十几千瓦的输出功率范围内已越来越多地得到采用。

Half-bridge circuit economizes two power switches and two thick-film drive integrated circuits compared with full-bridge circuit , so the application of half-bridge circuit is increasing when the output power range is from kilowatts to tens kilowatts .

MCM在厚膜混合集成电路中的应用

The Application of MCM in Thick Film Hybrid Integrated Circuit

结合厚膜混合集成电路的测试要求。着重介绍了基于PCI总线的卡式仪器及基于GPIB接口控制的程控仪器。

Aimed at the test requirements of hybrid Ices , the paper also focuses on the description of PCI bus module Instruments , and GPIB program-controlled instruments .

GH-039带有过电流保护功能的高速大容量IGBT厚膜驱动器集成电路

High-speed and large capacity IGBT of thick film driver integrated circuit GH-039 with over-current protection function

军用厚膜混合集成电路PIND试验不合格原因分析及控制方法

The Military Thick-film Hybrid Integrated Circuits Analysis of the Unqualified Reason and Control Methods of PIND Test Failure

本文从厚膜混合集成电路生产线应用统计过程控制（SPC）技术的需求、意义、实施方案等入手，结合厚膜混合集成电路的工艺特点，给出厚膜混合集成电路印刷工序应用SPC技术的方法。

The article begins with requirement and meaning and actualize precept of thick-film hybrid IC products line apply SPC Statistical Process Control , combined with the craftwork characters of HIC , and gives the way to the HIC products apply SPC.

汽车电子产品与厚膜混合集成电路

Electronic products for motors & HIC

热成像技术在厚膜混合集成电路热设计中的应用图形法-厚膜电路工艺用

The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC graphic-art technique

同时，说明了虚拟仪器技术在厚膜混合集成电路测试中的设计步骤和应用流程。

At the same time , the designated procedures and application flowchart of Virtual Instrument technology in HIC circuits measurement is studied .

采用专用的厚膜大功率集成电路，具高精度的稳压及恒流输出特牲。

Applied dedicated thick diaphragm and high-power integrated circuit to have high precision on voltage stability and constant current output .

厚膜集成压力传感器放大电路设计

Design of Amplifying Circuits in the Thick Film Integrated Pressure Sensor

厚膜电阻器是混合集成电路中最重要的元件之一。

Thick film resistance is one of the most important components in hybrid integrated circuit .

研制出高可靠的厚膜混合集成DC/DC电源电路需要解决一系列厚膜混合集成工艺技术问题。

Developed the high reliable thick-film hybrid integrated DC / DC power supply circuit needs to solve a series of thick-film hybrid integrated technology problems .

厚膜混合集成DC/DC电源电路具有体积小、重量轻、可靠性高的特点，广泛应用于航空、航天系统中。

Thick-film hybrid integrated DC / DC power supply circuit has the characteristics of small size , light weight and high reliability , and widely used in aviation , aerospace system .

将集成压力传感器作为一种特殊的集成电路，采用厚膜工艺与表面组装技术，以厚膜混合集成电路的形式，实现了扩散硅力敏元件与温度补偿电路及信号放大电路的集成。

Considered as a special IC , the pressure sensor integrates diffusion silicon sensing element , circuit for temperature compensation and signal conditioned circuit on a chip in the form of thick film hybrid IC , through using thick film technology and surface mounting technology .