高密度板
- 网络High Density Board;hdf
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强化木地板的基材是高密度板,但并不等于密度越高的强化木地板就越好。
The base material of aggrandizement wood floor is high density board , but it is better to not be equal to density to jump over tall aggrandizement wood floor .
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实验中长空间的墙壁分别是高密度板和具有很高吸声性能的吸声棉,以模拟不同的边界条件。
In experiments , the enclosure walls are lined with high density fiberboard and high sound-absorbing glass wool to simulate different boundaries .
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E1级中/高密度纤维板吸水厚度膨胀率偏高的原因及其解决方案
Study on the Reason for High Thickness Swelling of E_1 MDF / HDF and its Solutions
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用UV激光加工高密度印制板
Process ing High Density Boards with UV Laser
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要生产出适合于高密度电路板(HDI)使用的低轮廓电子铜箔更加困难和紧迫。
So to produce the suitable low profile electronic copper foil for high density circuit board ( HDI ) is more difficult and pressing .
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欧洲高密度纤维板生产设备考察
Investigation on Equipment for Producing Thin High Density Fiberboard in Europe
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我国中高密度纤维板现状和发展趋势分析
Status and Development Trend of Medium and High Density Fiberboard in China
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中高密度纤维板质量控制的探讨
A Discussion on the Quality Control of Medium and High Density Fibre Panel
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浅析原料对中/高密度纤维板性能的影响
Influence of Raw Materials on MDF / HDF Properties
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用稻(麦)壳与枝桠材制造中/高密度纤维板的生产工艺
Manufacturing Process of Rice ( wheat ) Husk-Branchwood Medium ( High ) Density Fiberboard
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薄型高密度纤维板的研制
Development of thin high - density fiber board
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高密度纤维板连续平压生产线工艺设计
Technology designing for high-density fiberboard continuous press line
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大板面高密度印制板的双面贴装技术
Double - Sided Assembly Technology for Printed Circuit Board of Large Panel and High Density
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高密度纤维板自动堆垛机控制系统
Control System of Automatic MDP Stacker
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但为什么实木台面包含有高密度纤维板?
But why does a solid wood table made from American Alder contain high density fiberboards ?
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特别适用于大面积,高密度线路板的冲切工序。
It 's very suitable for the punch cut process of large size high density PCB .
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第一层顶入对方,然后粘在高密度纤维板核心。
First the top layers are joined to each other and then glued to the HDF core .
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间伐竹部分替代木材生产高密度纤维板的试验研究
Investigation on using bamboo thinnings as raw material to replace wood for the producing High Density Fiberboard
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简要介绍我国中/高密度纤维板生产的发展过程,生产能力和产量;
The development progress , production capacity and output of MDF and HDF in China are introduced .
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研究开发中高密度纤维板及兽药等高科技产品。
Our company has researched and developed high-tech products which are middle and high density fibreboard and animal medicine .
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环保中/高密度纤维板生产成本与性能问题系统解决方案的研究(Ⅲ)
Study on Solution System of Production Cost and Board Performance for Manufacturing Low Formaldehyde Medium / High Density Fiberboard (ⅲ)
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研制以意杨、马尾松混合材为原料生产地板用薄型高密度纤维板。
The development of thin high-density fiberboard which made of mix material Populus and Pinus massonia was studied in the paper .
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公司现有绿色环保型密度板,中高密度纤维板,防火阻燃板,强化木地板等产品。
Company 's existing green environment-friendly MDF , in high-density fiberboard , fire retardant board , Laminate flooring and other products .
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结果表明,生产这种混合材地板用薄型高密度纤维板,不但在技术上可行、经济上也是合理和高效的。
Using the thin high-density fiberboard for mixed material floor board has good characters with feasible technology , reasonable financial and obvious benefits .
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采用优选工艺制得的产品各项指标均达到或优于欧洲地板用高密度纤维板标准。
The main physical and mechanical properties of the board prepared according to optimum condition met the requirements of floor HDF specified in European Standard .
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江南计算技术研究所无锡无线电十厂作为国内高密度印制板主要生产研制单位之一,承担了许多国家重点工程高密度印制板的生产。
As the main manufacturer of high density PCB , the tenth wireless factory of WuXi in Jiangnan Computing Technology Institute undertakes much production mission .
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传统的单面板、双面板已经远远不能满足需求,多层板、高密度互连板已经广泛的应用于中高端的电子产品中。
The traditional single-sided , double-panel has been far from satisfying the demand , multilayer , high density interconnect board has been widely used in high-end electronic products .
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“它是一件实木家具,但它不能被称为纯实木家具,因为它由高密度纤维板组合而成的”。
It 's a piece of solid wood furniture , but it can 't be called pure solid wood furniture , because there are high density fiberboards inside .
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中高密度纤维板强于异型加工,对其进行镂铣可达到完美造型。因而适应您产品的各种外观要求。
Middle high density fiberboard is better than irregularly machining ; it can have perfect shape after carving . So it adapts to your product with different outwards appearance .
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论文首先简述了印制电路板从简单的单面板、双面板到高密度互连板的发展过程,高密度互连板的设计研究现状及本论文需要完成的主要工作。
Paper first outlines the printed circuit board to the development of high-density interconnect board process , the design of HDI board Research and the paper needs major work done .