电铸

Cu/SiCP材料的复合电铸制备工艺

Cu / SiC_p composite of the composite electroforming technology fabricating

其主要工艺有X射线光刻，电铸成型和塑料铸模等。

LIGA technology mainly includes X-ray lithography , electroforming and plastic molding .

复合电铸制备Cu/SiCp复合材料

Composite electroforming of Cu / SiC_p composites

基于微电铸的非硅MEMS加速度传感器

Non - silicon MEMS accelerometer based on micro electroplating

脉冲电铸制备纳米CeO2增强镍基复合材料

Nano-CeO_2 / Ni Composites Prepared by Pulse Electroforming

X射线衍射研究电铸模具镍镀层

Studies on the Texture and Internal Stress σ _I of Nickel Electrodeposits on Electroformed Mould by means of X-Ray Diffraction

为了设计出导电的Ni微变截面悬臂梁，采用了基于成熟的电镀技术的微电铸工艺。

Micro-electroplating based on the mature electrodepositing technology was applied to design conductive Ni micro-cantilever with different cross-section .

极板放置方式对电铸层中微米/纳米SiC复合量影响的研究

Study on Position of Electrode-plates Based on the Effect of SiC Content in Ni-SiC Electroforming Deposits

微电铸及其在MEMS中的应用

Theory and Application of Micro-electroforming in MEMS

电铸与电弧喷涂相结合制造EDM电极

Electro - forming combining with arc-spray to manufacture EDM electrode

微电铸技术是MEMS领域中的一种重要的微加工方法。

Micro electroforming technology is a kind of important micro-machining method in the field of MEMS .

在氨基磺酸镍镀液中电铸制备了两种不同SiC微粒含量的复合材料，研究了热处理对复合材料的抗拉强度和微观组织的影响。

Ni-SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath .

工艺参数对电铸Ni-Mn合金中Mn含量的影响

Effects of Process Parameters on Mn Content in Electroformed Ni-Mn Alloy

介绍了一种新的MEMS器件敏感芯片的制备技术&选择性电铸技术。

Selectively electroforming technology is introduced , which is a new technology used in fabricating sensitive chips of MEMS devices .

随着复合铸层中n-TiN粒子含量增加，电铸层更加平整、组织更加致密；脉冲电流密度的增大，会降低复合铸层中TiN复合粒子的含量，结晶也就越粗大。

Pulse current density increases , the nano TiN composite particle content reduce in composite electroforming layer , also crystallization more bulky .

对LIGA工艺掩膜、X射线光刻、电铸及塑铸等进行了工艺原理分析。

The principles of LIGA process on mask , X ray lithography , electroform and model were analyzed .

含纳米ZrO2颗粒复合电铸层高温氧化行为研究

Oxidation behavior of Ni-ZrO_2 nano-composite electroforming deposits at high temperature

电铸nano-Al2O3/Cu复合材料的组织与性能

Microstructure and property of electroformed nano-Al_2O_3 / Cu composite

Fe-SiCp复合电铸层的制备工艺

Preparation Technology of Fe-SiC_p Composite Electroform

LIGA技术微电铸镍的电化学研究

An Electrochemical Study of Micro-electroforming Ni for LIGA Technique

复合电铸Ni-La2O3纳米复合材料的组织结构和性能

Microstructure and Properties of Ni-La_2O_3 Nanocomposites Prepared by Composite Electroforming

精密模具电铸Ni-Co工艺的研究

Study on the Technology of Electroforming Ni-Co on Precision Mould

本文介绍用于微型机械LIGA工艺的精密电铸设备。

A precision plating device applied to LIGA technology is introduced in this paper .

LIGA工艺中微电铸工艺研究

The study of micro - electroform in LIGA

为了控制无氰K金（Au－Cu二元合金）电铸沉积层的合金成分，研究了影响沉积层合金成分的几个因素及其影响情况。

In order to control the composition of Au Cu binary alloys deposition without cyanide . The parameters that affect the composition have been investigated by periodic reverse pulse electroforming .

指出了影响这些电铸层性能的5种因素，即电流密度、电铸温度、pH值、杂质离子及电铸层的热处理温度，同时还论述了电铸液的管理方法。

The five factors ( electric current density , electro plate temperature , PH , foreign ion and heattreated temperature ) which can change the properties of the electroplate layers have been pointed out .

得到了一套简单可行的LOM原型的电铸预处理工艺。

A kind of simple and convenient pretreatment process of electroforming for LOM prototype was obtained .

脉冲电铸及铸层质量研究实验结果表明，采用方波脉冲电铸能够得到晶粒粗细均匀、硬度和应力符合设计要求的悬臂梁等MEMS结构。

Pulse Current Electroforming and Quality of Electroformed Parts Experimental results indicate , cantilever and some else structural layers in MEMS can be fabricated by Micro - electroforming .

系统研究了直流电铸工艺参数、脉冲电流、添加剂硫脲以及电铸液中加入纳米Al2O3颗粒时对电铸层表面形貌的影响。

The effects of direct current , pulse current , thiourea and nano-Al2O3 particles on the surface morphology of the copper deposits are researched systematically .

利用SU-8光刻胶制备电铸模和微电铸工艺，制造了二维微执行器原型。

The prototype of the micro actuator is fabricated by means of micro electroforming and SU-8 photolithography techniques .