焦磷酸铜
- 网络Copper pyrophosphate
焦磷酸铜-
以焦磷酸钾为主络合剂、酒石酸钾钠为辅助络合剂，自制焦磷酸铜、焦磷酸锌为主盐进行了玻璃钢无氰Cu-Zn-Sn-Ni四元合金电镀工艺研究。
Technology of non-cyanide Cu-Zn-Sn-Ni tetrabasic alloy imitative gold electroplating on FRP was studied using potassium pyrophosphate as main complexing agent , potassium sodium tartrate as auxiliary complexing agent and laboratory-synthesized copper pyrophosphate and zinc pyrophosphate as main salts .
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分光光度法快速测定镀液中的焦磷酸铜
The Fast Determination of Cupric Pyrophosphate in Copper Plating Solution by Spectrophotometric Method
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镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。
The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate .