焦磷酸盐

本文给出一种碱性焦磷酸盐镀液及其电沉积工艺，以获得Sn-Ag无Pb焊料的可焊性镀层。

In this paper , an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating .

结果表明，所制备的阻燃剂MPP是由三聚氰胺聚磷酸盐和三聚氰胺焦磷酸盐构成，以前者为主。

The experimental results show that the prepared flame retardant ( MPP ) is composed of melamine polyphosphate , which proves to be the main component , and melamine pyrophosphate .

最后还讨论了镀液的维护与控制，强调了要防止正磷酸盐积累太多，必需严格控制pH值、温度和焦磷酸盐配比量；

The pH value , temperature and the ratio of pyrophosphate should all be controlled strictly to prevent the accumulation of phosphate .

碱性焦磷酸盐镀液电镀Sn-Ag无Pb钎料的研究

Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath

对80例急性心肌梗塞（AMI）患者及12例非AMI患者作99m锝－焦磷酸盐（99mTc－PYP）心肌闪烁图，探讨其临床应用价值。

Abstract Eighty patients with AMI and 12 non-AMI had myocardial scintigrams by 99m Tc-PYP .

运动与多巴酚丁胺负荷~（99m）锝焦磷酸盐心肌显像诊断冠心病价值的比较

Comparison of dobutamine and exercise technetium ~ ( 99m ) Tc MIBI myocardial imaging in the diagnosis of coronary heart disease

本文报道了用亚锡-焦磷酸盐在体内标记~（99m）Tc-红细胞作为血池显像剂；

This paper describes the way of in vivo labelling of the blood pool imaging agent ~ ( 99m ) Tc-RBC by stannous - pyrophosphate method .

用正交方法，通过赫尔槽试验，研究了镀液组成、温度、电流密度、pH值等工艺参数对锡钴合金镀层质量的影响，优选出一种焦磷酸盐型的镀液。

By the application of orthogonal design and through Hull Cell tests , the effect of process parameters such as bath components , temperature , current density and pH on the quality of Sn-Co alloy deposits are studied , resulting in an optimized pyrophosphate based Sn-Co alloy plating bath .

目的比较多巴酚丁胺和运动99m锝焦磷酸盐心肌显像诊断冠心病的价值。

Objective The aim of this study is to compare the values of dobutamine ( DB T ) stress test and exercise ( Ex ) 99m Tc MIBI myocardial imaging in the diagnosis of coronary heart disease ( CHD ) .

研究了酸性焦磷酸盐（SAPP）、焦磷酸盐（TSPP）、三聚磷酸盐（STPP）对牛肉半腱肌的嫩化作用。

The tenderizing effects of sodium acid pyrophosphate ( SAPP ), tetrasodium pyrophosphate ( TSPP ) and sodium tripolyphosphate ( STPP ) on beef semitendinos muscle were studied .

在电解铜箔上采用碱性焦磷酸盐体系电镀Zn-Sn合金，可改善铜箔表面的综合性能。

The combination properties of copper foil surface can be improved by electroplating Zn-Sn alloy on it using alkaline pyrophosphate system .

为了解决焦磷酸盐镀铜锡合金镀液的稳定性问题，对KNO3在镀液中的作用机理进了探讨。

Cyclic voltammetry was used to investigate the action mechanism of KNO_3 in the electroplating of Cu-Sn alloy coating from a pyrophosphate bath , which was aiming at increasing the stability of the plating bath .

研究开发的焦磷酸盐防渗镀铜工艺，使镀铜工序时间从1～2h缩短到15～20min，可镀取镀层致密、孔隙率低的防渗铜镀层。

The newly developed technology of anti - permeatingcopper - plating with pyrophosphate has decreased the time of copper - plating from 1 - 2 hours to 15 - 20 minutes . This technology could densify the plating and decrease its hole rate .

焦磷酸盐镀液中总焦磷酸根的快速测定

Rapid Determination of Total Pyrophosphoric Acid Group in Pyrophosphate Plating Solution

利用掺杂金刚石膜电极电合成过氧焦磷酸盐硼掺杂金刚石膜电极电催化降解环己酮废水

Electro-catalytic degradation of wastewater containing cyclohexanone using boron-doped diamond film electrode

焦磷酸盐镀铜废水处理方法的研究

The Test and Study on Treatment of Pyrophosphate Coppering Wastewater

焦磷酸盐镀铜液中正磷酸盐含量对镀层性能的影响

Influence of orthophosphate content on coating characteristic in pyrophosphate copper plating bath

关于铜锡锌焦磷酸盐仿金工艺的探讨

Research on the deposition of Cu-Zn-Sn alloy from pyrophosphate bath

焦磷酸盐电镀铜锡合金电极过程

On Electrode process of Electroplating Cu-Su Alloy with Pyrophosphate-Stannate

镁合金焦磷酸盐镀铜工艺的研究

Investigation of Electroplating Copper in Pyrophosphate on Magnesium Alloy

焦磷酸盐&锡酸盐电镀铜锡合金电极过程的研究

Electrode Kinetics of Cu-Sn alloy electroplating With Pyrophosphate-Stannate

酸性溶液中由焦磷酸盐合成法；

Prepared by pyrophosphate and melamine in acid .

高稳定型焦磷酸盐预镀铜工艺的改进

Improvement of Highly Stable Pyrophosphate Copper Strike

焦磷酸盐体系化学镀钴磷合金工艺研究

Study on Electroless Co-P in pyrophosphate system

不同品质的焦磷酸盐对电镀铜的影响

Effect of pyrophosphate quality on copper electroplating

焦磷酸盐电镀铜初始过程研究

Initial Process of Pyrophosphate Copper Electroplating

它的抑制作用与焦磷酸盐作了对比，并观察了它的抑制机理。

Their inhibitory mechanism was observed .

焦磷酸盐铜锌合金镀液中磷酸二氢钾的测定

Determinations of potassium dihydrogen phosphate in the electroplating solution of copper and zinc alloy of pyrophosphate

钢铁件直接焦磷酸盐镀铜结合力不良的关键

Keypoints of Weak Adhesion of Copper Coating on Iron and Steel Articles Direct Plated in Pyrophosphate Bath

焦磷酸盐溶液中铜电沉积过程Ⅱ.用旋转电极的研究

The electrode processes of copper electrodeposition for pyrophosphate solution ⅲ . the study by rotating electrode method