热导
- heat conductance;thermal conductance
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[thermal conductance] 透过某种材料的热量除以材料两表面间的温度差,类似于电学中的电导
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该文应用有限时间热力学方法研究了实际闭式燃气轮机循环热效率最大时高低温侧换热器、回热器和中冷器的热导率最佳分配和最佳中间压比分配;
In this paper , finite-time thermodynamics is applied to optimize the intercooling pressure ratio and the heat conductance distribution of hot-and cold-side heat exchangers , intercooler and regenerator of a real closed intercooled regenerated Brayton cycle .
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反重力高度和环境对回流液体的加热是可变热导区的成因;
Adverse gravity elevation and the heating from environment to the return liquid are the reason of the generation of the variable heat conductance zone ;
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C/Al复合材料热导率各向异性研究
Investigation of thermal conductivity anisotropy of c / al Composites
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片状Al2O3对Al2O3/FEP复合材料热导率的影响
Effects of alumina platelets on thermal conductivity of Al_2O_3 / FEP composite
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高比例SiCp/Al复合材料的有效热导率模型
Effective Thermal Conductivity Model of High Volume SiC_p / Al Composite
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掺Nd钒酸盐晶体热导率的拉曼光谱研究
Raman Spectra Study of Thermal Conductivity of Nd-doped Vanadate Crystals
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复合助剂Y2O3-CaC2对氮化铝陶瓷热导率的影响
Influence of compound additive Y_2O_3-CaC_2 en the thermal conductivity of AIN
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本文研究了一种新型微机械CMOS热导压力敏感器。
A new micromachined CMOS thermal conductivity pressure sensor has been developed .
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C元素增加钢的热导率;随温度的增加,纯铁的热导率降低,同时各合金元素对热导率的影响下降。
With temperature increasing , the thermal conductivity of pure iron decreases and the influences of various alloying elements on thermal conductivity weaken .
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用涂层热线法测量含SiC耐火混合料的热导率
Determination of thermal conductivity of SiC-bearing refractory mixture by improved hot-wire method with insulate coating
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CVD金刚石薄膜晶粒尺寸对热导率的影响
Effect of grain size of CVD diamond film on thermal conductivity
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W-Cu合金中Cu相纯度对热导的影响
Effect of Cu purity on the thermal conductivity of W Cu Composites
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Sb取代Ga后对化合物的热性能有较大影响,其热导率和晶格热导率都有不同程度的降低;
The substituting Sb for Ga has a great influence on the thermal properties of the compounds .
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应用MCS-51单片机研制热导率测试仪
The Development of Heat Conduction Coefficient Detector Basing on MCS-51 SCM
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一维原子链的热导模拟Nb高温合金。
Simulation of Heat Conduction in One-dimensional Chains Nb high temperature alloys are generally used .
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掺杂YAG和GGG激光晶体热导率研究
Study on thermal conductivity of the YAG and GGG laser crystal
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AlN陶瓷基板材料热导率与烧结助剂的研究进展
Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material
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添加CaF2-YF3的AlN陶瓷的热导率
Thermal Conductivity of AlN Ceramics with CaF_2-YF_3 Addition
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本实用新型采用运用MEMS技术和半导体工艺集成而成的热导传感器,有效提高了测量精度和可靠性;
The thermal conductivity sensor integrating MEMS and semi-conductor technique can effectively enhance the measuring precision and reliability of the instrument .
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用基于有限元分析的软件结合Si桥结构参数对各测量点的温升进行了模拟计算,其结果在热导分布的基本趋势上与实验相一致。
Compared with the simulated temperature distribution obtained by the finite element software , the experimental and theoretical results are in agreement with each other .
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孔隙对放电等离子烧结SiCp/Al复合材料热导率影响的数值研究
Numerical Study of the Effect of Porosity on the Thermal Conductivity of Spark Plasma Sintered ( SPS ) Consolidated SiC_p / Al Composites
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研究了激光切割对CVD金刚石膜三点弯曲断裂强度和热导率的影响。
The effect of laser cutting to CVD diamond films on thermal conductivity and three point bending strength is studied .
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我们的结果表明AU和CU拥有相类似的声子色散关系,这样就使得他们的热导是可以比拟的。
The results show that the AU and CU share the similar phonon spectrum , inducing the thermal conductance between these two materials is comparable .
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热导率的变化与热扩散率的变化有相似的规律;材料的热膨胀系数随温度的升高单调递增,温度上升相同情况下,材料的热膨胀系数随Ni含量的增加而增加。
Thermal expansion coefficient of TiC-Ni cermets increased monotonously with temperature increasing , and also increased with Ni content when the cermets were heated to the same temperature .
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PTR方法对材料热扩散率和热导率的研究
Study on the Thermal Diffusivity and Thermal Conductivity by PTR Method
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SIMOX硅片埋氧层垂直方向热导率的测量
Measurement of Thermal Conductivity of Buried Oxides of SOI by SIMOX
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随着复合材料中Si元素总量的增加,复合材料的定比压热容、热膨胀系数、热扩散系数和热导率均逐渐降低;
The specific capacity , the average coefficient of thermal expansion , the coefficient of thermal diffusion and the thermal conductivity of the composites decrease gradually with increasing Si content .
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GaN具有禁带宽、热导率高等特点,广泛应用于光电子和微电子器件领域。
Gallium nitride has been widely used in optoelectronic and microelectronic devices field because of its large , direct bandgap , high thermal stability , etc.
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Sb组成的20面体空洞部分被Ba,Ce填充时,晶格热导率最小,填充原子的扰动对声子的散射作用最强。
The lowest lattice thermal conductivity and strongest rattling actions of filling atoms to the scattering of phonons are gained when the Sb-icosahedron voids are partly filled .
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堆内测量UO2燃料元件的有效热导率
Measuring equivalent thermal conductivity of uo_2 fuel element under irradiation