混合集成电路

我国混合集成电路（HIC）已从引进、消化转入自主开发。

HIC of China have already changed from importing their production lines and digesting them to independent development .

功率器件在薄膜混合集成电路上的应用

Application of Power Devices on Thin Film HIC

CAE工程及其与单片集成和混合集成电路的关系

CAE Engineering and Its Relations with the Monolithic and Hybrid Integrated Circuits

MCM在厚膜混合集成电路中的应用

The Application of MCM in Thick Film Hybrid Integrated Circuit

CMOS图像传感器是集光电探测器、模拟电路和数字电路于一体功能完善的超大规模数模混合集成电路。

CMOS image sensor is a very large-scale mixed integrated system , integrated with photodetectors , analog circuits and digital circuits .

电源电流（Idd）测试对模拟/混合集成电路的故障诊断十分有效。

Power circuit test is very efficient for fault diagnosis of simulated / mixed integrated circuit .

文章介绍了一种基于动态扫描原理的液晶显示（LCD）驱动芯片，该芯片为高压CMOS数模混合集成电路。

A single chip Liquid Crystal Display ( LCD ) driver chip is developed based on dynamic scanning , which is a high voltage CMOS digital and analog mixed signal IC .

结合厚膜混合集成电路的测试要求。着重介绍了基于PCI总线的卡式仪器及基于GPIB接口控制的程控仪器。

Aimed at the test requirements of hybrid Ices , the paper also focuses on the description of PCI bus module Instruments , and GPIB program-controlled instruments .

采用微波混合集成电路设计方法，用二只并联PIN二极管芯片和一只检波二极管芯片，在很小的腔体内制作了微波限幅器模块。

The microwave limiter modules have been designed and fabricated with hybrid integrated circuit in a small size , it has been fabricated with two PIN diode chips and a single detector diode chip .

毫米波多芯片组件（MCM）是一种混合集成电路技术，是减小系统体积和重量的有效途径。

The millimeter wave multi-chip module ( MCM ) is attributed the technology of hybrid integrated circuit , and it can effectively decrease systemic volume and weight .

在现代混合集成电路中极大部分的采用了数字电路，只有极小部分采用了模拟电路，因此，数字CMOS工艺成为工艺设计的必然。

As most of the modern hybrid integrated circuits use the digital circuits , and only few use the analog circuit , so the digital CMOS process is bound to be used for the design process .

NRD波导的激励是平面/非平面微波混合集成电路的一个关键问题。

The excitation of NRD guide is a key-problem to the planar / non-planar microwave hybrid integrated circuit .

军用厚膜混合集成电路PIND试验不合格原因分析及控制方法

The Military Thick-film Hybrid Integrated Circuits Analysis of the Unqualified Reason and Control Methods of PIND Test Failure

混合集成电路是军事／航天电子装备的重要基础元件，军用HIC的相关技术是保证半导体IC芯片的品质，解决散热问题，实现产品的高稳定、高可靠。

HIC 's are very important basic devices for military and space equipment . They are highly dependent on the good quality of naked chips , perfect heat elimination , high stability and high reliability .

多芯片组件技术（MCM）是混合集成电路技术向高级阶段发展的产物，是一种先进的电子系统组装技术，具有小型化、轻型化、高性能、高可靠性等主要特点。

Multi-Chip Module ( MCM ) that has the characteristics of miniaturization , light-duty , excellent performance and high dependability is an advanced hybrid integrated circuit technology and electronic system assembly technology .

理论分析和电路模拟结果都表明，和静态CMOS电路相比，电流控制逻辑的峰值开关电流下降了近两个数量级.该逻辑可应用在高性能的模／数混合集成电路中。

Theoretical analysis and simulation results show that in this new logic , the power supply current spikes are about two orders of magnitude smaller than those generated in static CMOS . It is suitable to be used in high Performance mixed-mode ICs .

本文从厚膜混合集成电路生产线应用统计过程控制（SPC）技术的需求、意义、实施方案等入手，结合厚膜混合集成电路的工艺特点，给出厚膜混合集成电路印刷工序应用SPC技术的方法。

The article begins with requirement and meaning and actualize precept of thick-film hybrid IC products line apply SPC Statistical Process Control , combined with the craftwork characters of HIC , and gives the way to the HIC products apply SPC.

通过引入通用测试仪表组，运用GPIB总线控制等方法，开发研制了集成电路入检设备，该设备可对混合集成电路模块在常温条件下的技术指标进行测试。

By introducing the general measuring appliance group , applying GPIB bus control and so on , this special integrated circuit check testing equipment is developed , which can test the technical specifications of hybrid integrated circuit module under the normal temperature .

提出了该类器件电参数的测试方案及实现方法。基于SP3160Ⅱ大规模混合集成电路测试系统软硬件资源，实现了PWM器件电参数的全面测试。

Proposing testing solutions and achieving methods of electrical parameters and combining with the software and hardware resource of SP3160 ⅱ Large-scale mixed integrated circuit testing system , the testing of all electrical parameters of PWM has been fulfilled .

这种ATM交换模块采用了单级CMOS-SEED混合集成电路芯片及少量的光学元件，具有吞吐量大、稳定性高、封装调试容易等特点。

A novel ATM photonic switching module has been proposed . The module is made of a single stage CMOS-SEED hybrid integrated circuit chip and a few optical elements , featuring high throughput , high stability , and ease of alignment .

介绍工序能力指数基本概念，表述在混合集成电路生产线中实施CPK评价的实践和流程，指出存在的问题，以及从工序能力分析的角度理解6σ设计目标。

The basic conception of CPK is introduced in this paper . It also describes the practic and process flow of CPK evaluation implemented in HIC production line . The author pointed out the exiting problem and 6 σ design goal based on the analysis of ( CPk ) .

高性能混合集成电路有源滤波器的分析设计

Design and Analysis of Active Filters With High Quality Integrated Circuit

混合集成电路高线性锁相鉴频模块的研制

Development of Hybrid Integrated Circuit of High Linear Phase-Locked Frequency Discriminator

混合集成电路铜功率外壳气密性失效分析

Failure Analysis of Leakage on Hybrid Integrated Circuit Copper Power Shell

面向模拟和数模混合集成电路的自动布线方法研究

Research on Automatic Routing Methodologies for Analog and Mixed-Signal Integrated Circuits

混合集成电路单向泄漏问题分析

An Analysis on One-Way - Leaker Problems in Hybrid IC 's

混合集成电路在大型集装箱检查系统阵列探测器上的应用

The application of hybrid integrated circuits in the large container inspect system

混合集成电路常见装配结构热阻分析

An Analysis on Thermal Resistance of Assembly Structures for Hybrid IC 's

GB/T15138-1994膜集成电路和混合集成电路外形尺寸

Case outlines for film integrated circuits and hybrid integrated circuits

混合集成电路用无寄生参数载体

Non - parasitic Parameter Carrier in Mixed Integrated Circuit