晶圆清洗

在总的构成先进的90nm器件工艺步骤中，晶圆清洗工艺占了近15%。

Wafer cleaning represents up to 15 % of the total process steps to build an advanced , 90-nm semiconductor device and is still mainly carried out in batch processes .

晶圆清洗作业对无尘工作环境和清洗设备都有很高的要求。

Wafer cleaning machine have high demands on the dust-free working environment and cleaning equipment .

目前晶圆清洗机采用直流伺服电动机作为驱动电机，但碳刷的磨损给无尘工作环境带来了污染，增加了维护成本。

Currently , wafer cleaning machine are drived by DC servo motor , but wearing and tearing of the carbon brush has polluted to the dust-free working environment , increasing the cost of maintenance .

从IC生产线晶圆片旋转冲洗甩干工艺出发，介绍了半导体晶圆片清洗后的旋转冲洗甩干方法，以及新近开发研制的CXS系列旋转冲洗甩干机的技术原理、结构特点及工艺应用情况。

Drying process in IC production line , introducing spin rinsing ? drying methods after semiconductor wafer cleaning . Also describing the technical principle , structure fea-tures and process applications for newly developed CXS series spin rinse ?

看板在晶圆厂清洗-炉管间的派工应用及仿真

Application and Simulation of Kanban for Cleaning-Furnace Dispatching in Wafer Fab

在集成电路的生产制造过程中，晶圆的清洗和干燥工艺是使用最频繁、重复次数最多的工艺过程。

Hundred times of cleaning and drying process is applied during wafers manufacturing .

半导体晶圆自动清洗设备

Silicon Wafer Auto Clean Equipment

通过晶圆厂仿真模型进行模拟，结果显示看板可以解决晶圆生产在清洗工艺后存在违反等待时间限制的情况，可以显著提高炉管设备的利用率，并且明显降低产品的生产周期时间。

The wafer fab simulation results show that the new method can solve rework problem resulted from violating " queuing time limit " after cleaning , the furnace utilization is promoted greatly and cycle time is decreased evidently .