扁平封装

建立了四边引线塑料扁平封装（PQFP，PlasticQuadFlatPackage）数值热模拟的详细模型和简化模型，实验验证了这两种模型的模拟精度。

The numerical detailed model and compact model were created for plastic quad flat package ( PQFP ), and the accuracy of two models was verified by the measurement values .

GB/T15876-1995塑料四面引线扁平封装引线框架规范

Specification of lead frames for plastic quad flat package

最后对塑料四边引线扁平封装（PQFP）IC翘曲的测量值与预测值进行比较。

At last , compared the measured data with prediction for the warpage of PQFP IC .

适合便携式设备的微型扁平封装光耦合器

Mini-Flat Package Optocouplers Meet the Size Requirements of Portable and Compact Devices

超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势

Comparison between Ultra-fine Pitch QFPs and BGAs and their Future

采用90W半导体激光软钎焊系统对方形扁平式封装器件（QFP）进行了焊接试验研究，并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。

Soldering technology for quad flat pack devices ( QFP ) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power .

采用微焊点强度测试仪（STR-1000型）测试了方形扁平式封装器件（QFP）的抗拉强度，并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。

Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ) .

本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。

The research in this thesis is supported by the National Natural Science Foundation Project . The structure and dimension parameters of Quad Flat no-lead package ( QFN ) devices has been optimized and analyzed .