关键工艺

实验当中，对基底进行加温，调节溅射过程中关键工艺参数&氧分压，并对所制备Zr掺杂ZnO薄膜进行结构与形貌的表征与研究。

The basement was heated , in order to study the structure and morphology of the prepared Zr doped ZnO thin films , we also regulated the sputtering process of critical process parameters-oxygen partial pressure .

运用反应射频溅射的方法进行了TiN薄膜的制备，通过改变关键工艺参数，如氩气氮气比、气体压力等，研究工艺参数对TiN薄膜特性的影响。

TiN membrane for MEMS applications is studied . The membrane is deposited by reactive RF sputtering , and the influence of critical process parameters , such as ration argon gas to nitrogen gas 、 gas pressure is investigated .

Cf/Al复合材料主承力构件成型关键工艺参数的控制

Control to Key Parameter of C_f / Al Composites Technology

制备并研究了TiN栅薄膜全耗尽SOICMOS器件，并对其关键工艺进行了详细阐述。

TiN gate thin-film fully-depleted SOI CMOS devices are fabricated and discussed .

本文主要工作是对微波PIN二极管的设计研究和关键工艺研究。

The design and key process research of the microwave PIN diode is written in the article .

碳化硅MOSFET的高温模型及关键工艺研究

High Temperature Model and the Key Processes of SiC MOSFET

基于TaurusWorkbench的亚微米n沟MOS器件关键工艺参数的优化

Optimization of Key Process Parameters for Submicron n-Channel MOS Transistors Based on Taurus Workbench

探讨了等离子体条件下氮化反应过程和影响TiN粉末粒度的关键工艺参数。

The nitriding reaction in the plasma and the process parameters influencing the particle size of powder were also studied .

硅烷处理PDP基板玻璃的关键工艺

The Key Technology of Disposing PDP 's Front Glasses Using Silane

IC封装企业的核心能力包括：研发创新新产品开发与设计能力、技术研发能力；工艺技术关键工艺技术掌握能力、工艺技术累积能力；

The core competence of IC packaging company including : Research and innovation-New product developing 、 Technology-the critical technology 、 the study ability of the technology ;

介绍了研制的岳阳洞庭湖大桥（三塔双索面PC斜拉桥）全桥静动力试验模型，重点介绍了该模型的结构设计及关键工艺。

In this paper , the authors introduce a large aluminum made test model of Yueyang Dongting bridge ( three tower PC cable stayed bridge with double cable faces ) .

在聚丙烯腈（PAN）基碳纤维的制备过程中，原丝的预氧化是影响碳纤维质量、碳收率和生产效率的关键工艺。

Oxidative stabilization of polyacrylonitrile ( PAN ) precursor fibers is an essential process that affects the quality , carbon yield and production efficiency of carbon fibers .

深度同步辐射光刻是LIGA技术的关键工艺环节。

The deep X-ray lithography with synchrotron radiation is a very important step in LIGA process .

ULSI中铜互连线技术的关键工艺

Key Technologies for Copper Interconnections in ULSI

隧道小孔中超薄SIO2的生长是EEPROM电路制造的关键工艺之一。

The growth of ultrathin SiO2 layer in tunnel region is one of the key processes in the fabrication of EEPROM 's.

介绍了100d/24f平列型潜在卷曲FDY长丝生产的关键工艺技术。

This article mainly introduces the key technology of producing potential FDY curly filament of 100d / 24f .

APCVD制备非晶硅的关键工艺参数分析

Analysis of Key Technology Parameters of a-Si : H Prepared by APCVD

在PAN基碳纤维的制备过程中，预氧丝的碳化是决定碳纤维质量的关键工艺之一。

Carbonization of the stabilized fiber is one of the essential processes which determine the quality of the resulting carbon fiber during the preparation of the polyacrylonitrile ( PAN ) - based carbon fiber .

介绍了Schmidt型双套管废热锅炉制造的关键工艺，扁圆管的压制模具，双套管热套装，总装经验。

This paper introduces the manufacture process for Schmidt cool waste boiler , such as flat-round pipe forming ; moulds , fit up of the Double-Sleeves .

RF-MEMS器件及其关键工艺技术

RF-MEMS Devices and Its Key Technology

本文就COF的结构，特点，所用材料，关键工艺，应用状况及其发展趋势进行了综述。

In this paper , the structure , features , key process , applications and developing direction of COF are summarized .

电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。

The plating copper is a key process in the production of PCB , which involves the quality assurance of metallization of PTH holes and laminate surface , and is affected by a number of factors .

研定表明，纺丝冷却速率是纺制含β晶相聚丙烯纤维的关键工艺因素，初生纤维中的K值、拉伸温度和拉伸倍数是纺制含微孔聚丙烯纤维的主要参数。

The result shows that the cooling rate is a key technological factor for manufacturing β phase crystalline IPP fiber , besides the K value in the as-spun fiber , stretching temperature and draw ratio are important parameters for manufacturing microporous IPP fiber .

明确SFSBR中颗粒污泥稳定运行、亚硝化稳定维持和N2O减量化的关键工艺条件，对于新工艺更好的实际应用并实现节能减排具有重要的意义。

It is of great significance for better practical application of the new technology and to achieve energy conservation .

针对高镁铝合金（Mg≥4%）挤压生产的工艺特点，对高镁铝合金挤压生产的常见问题和关键工艺参数进行了分析和总结，得出了较为符合生产实际的挤压生产工艺方案。

In view of process characteristics of extruded production for aluminum alloy with high Mg ( Mg ≥ 40 % ), common problems and key process parameters for aluminum alloy with high Mg are analyzed and summarized . The plan of extrusion production process is obtained .

本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对MCM种类、MCM关键工艺、MCM凸点的制作方法等做了简单介绍。

This paper described the C4 fabrication of Multi-chip-modules and the MCM process , and also described the key point of MCM technology 、 the variety of MCM 、 the bump fabrication methods .

本论文介绍了RBR过程控制技术在超大规模集成电路（ULSI）制造中的化学机械抛光（CMP）这一关键工艺中的应用。

Chemical-mechanical polishing ( CMP ) process is the key important planarization process in ULSI manufacturing . The RBR control applied on the CMP process is introduced in this paper .

文章论述了在液态排渣锅炉上实施SCR时的关键工艺选择，如SCR出口NOx浓度、脱硝率、氨逃逸量的关系；

This article discusses the selection of key technologies in the implementation of SCR in slag tapping boiler , such as : the relationship of exit NO_x concentration , denitration rate and slip quantity of ammonia of SCR ;

主要论述了CVD金刚石厚膜刀具制造过程中的几个关键工艺，包括切割、焊接、抛光和刃磨等，介绍了CVD金刚石膜刀具加工复合材料的实验研究。

The key manufacturing technology of CVD diamond thick film cutting tools , including incising , welding , polishing and grinding is mainly discussed , and machning multiplex using CVD diamond film cutting tools is studied in this paper .

在铁电不挥发存储器（FERAM）技术中，集成铁电电容的制备是关键工艺之一。

For fabricating the nonvolatile ferroelectric memories ( FERAM ), one of the keys is to make the integrated ferroelectric capacitors .