锡焊

xī hàn
  • soldering
锡焊锡焊
  1. SH-11和SH-12锡焊助焊剂的研制

    A Research on the Production of the SH-11 and SH-12 Soldering Fluxes

  2. 多焊点Hot-bar锡焊工艺参数优化

    Multi-spot Hot-bar Soldering Process Parameters Optimization

  3. 数据显示无铅无镉金导体和RoHS规定的可锡焊导体之间的匹配性,结果表明它可以应用于混合金属电路。

    Data will show compatibility between the lead and cadmium free gold conductor and a variety of RoHS compliant solderable conductors to allow for its use in mixed metallurgy circuits .

  4. 锡焊动态过程的研究

    The Research of Reflow Soldering On the Kinetic Process of Soldering

  5. 锡焊能够满意地做成加筋构件之间的接头。

    Joints between reinforcement members can be made satisfactorily with tin solder .

  6. 汽车仪表印刷电路板的手工锡焊

    The Hand Tin - lead Bonding of Auto Instrument Printed Circuit Board

  7. GB/T2424.17-1995电工电子产品环境试验锡焊试验导则

    Environmental testing for electric and electronic products & Guidance on soldering test

  8. 汽车用低压电线束的手工锡焊

    Handicraft Tin Welding of Low-Voltage Electric Harness For Automobile

  9. 当你焊接接口时,用锡焊很管用。

    Tinning the ends of the wires makes a better joint when you solder them .

  10. 用于焊接驻极体麦克风的锡焊机器人系统

    A robotic system for electret microphone soldering

  11. 背面的多余锡焊没有剃平。

    Some soldering is not smooth .

  12. 不要在加注后的空调系统的任何零件上进行焊接、锡焊和硬焊。

    No welding , soldering or hard-soldering should be carried out on any part of the filled air-conditioning system .

  13. 随着微电子产业对高密度封装和环保的要求与日剧增,传统的铅锡焊工艺越来越不能满足需要。

    As the increasing demand for high-density and environmental protection , the traditional lead solder process is hard to meet these needs .

  14. 为减少焊接缺陷,确保汽车仪表的性能,从5个方面阐述了对汽车仪表印刷电路板手工锡焊的品质控制措施。

    In order to reduce soldering defect and ensure the performance of auto instrument , this paper expounds its quality control measures from 5 ways .

  15. 详细介绍了汽车用低压电线束制作过程中导线手工锡焊的组成要素、工艺过程、质量检查。

    The composition elements , technical process and quality inspection of handicraft tin welding in the process of low-voltage electric harness for automobile are introduced in this paper .

  16. 电子焊料;电子助焊材料生产;新型电子材料研制开发;锡焊材料;电子元器件;电子工具销售。

    Electronic Hanliao ; Electronic help of welding materials production ; Research and development of new electronic materials ; Tin welding materials ; Electronic components ; Electronic marketing tools .

  17. 该工艺是两种金属之间直接熔接,焊点美观牢固,没有锡焊引起的脆裂、氧化、虚焊、假焊。

    The process is directly between the two types of metal welding , a solid solder joint appearance , there is no brittle fracture caused by tin solder , oxidation , solder false .

  18. 耐用,不易损坏,厚、薄塑料都能焊,只要调节火焰大小控制热气流温度就可以了,而且换上锡焊焊头还能进行锡焊。

    If only adjusting the size of flame to control the temperature of the hot airflow , it can solder whatever thick or thin plastic materials . Furthermore , tin head can be changed to carry out tin solder .

  19. 采用锡焊方法转移至铜基底工艺存在碳纳米管只是零散分布于铜箔上的缺陷,致其场发射性能不理想。

    When using the technics of stannum soldering to transfer the carbon nanotubes to the copper fundus has a flaw that the carbon nanotubes will straggle in the copper so that the field emission of it is not ideal .