铝碳化硅材料

研究铝碳化硅电子封装材料的结构与性能对制备性能优良的封装材料具有重要的理论意义和实用价值。

It is important to research the properties and preparation techniques of composites , in order to obtain the composites satisfy the application .

铝渗碳化硅电子封装材料的热物理性能

Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging

蓝晶石原位合成氮化铝结合碳化硅复相材料基于衰减电流分量的双树复小波相位选线原理

Line Selection Principle Using Dual-tree Complex Wavelet Phase Based on Decaying Current Component

氮化硅粘合碳化硅耐火材料蓝晶石原位合成氮化铝结合碳化硅复相材料

Silicon-nitride-bonded silicon carbide refractory In-situ Synthesis of AlN / SiC Multiphase Ceramics from Kyanite

铝－碳化硅颗粒复合材料的制备

The Preparation of Al-SiC Particulate Composite

硅钙镁晶须改性聚丙烯复合材料的研究蓝晶石原位合成氮化铝结合碳化硅复相材料

Study on Properties of SCM Whisker Reinforced PP Composites In-situ Synthesis of AlN / SiC Multiphase Ceramics from Kyanite

碳化硅/莫来石/氧化铝复合陶瓷的研制蓝晶石原位合成氮化铝结合碳化硅复相材料

Preparation and Research of Alumina Matrix Ceramic Composite Reinforced by Mullite and Silicon Carbide Particle ; In-situ Synthesis of AlN / SiC Multiphase Ceramics from Kyanite