超细金粉
- 网络super-fine powdered gold;Superfine gold powders
超细金粉-
2超细金粉应用于焊接型金导体浆料，满足欧姆接触和附着力的要求。
And with # 2 , ohm contact and adhesion meet the requirements .
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金导电胶是采用球形或近似球形，平均粒径为小于O.5μm的超细金粉，加入0.5%的锑粉以及热固性的树脂调合而成。
Gold conductive adhesive is composed of 0.5 % antimony powder , thermosetting resin and super fine globe powder whose average diameter is lower than 0 . 5 μ m.
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超细金粉主要用于配制金导体浆料、金粘接浆料和气敏元件焊接金浆料，也可用于其它材料作涂层的导电相。
Ultrafine powder is mainly used for preparation of gold conductor paste , slurry and gas sensor gold bonding gold paste welding can also be used for other materials for coating the conductive phase .
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超细铜金粉生产制造工艺优化及改造研究
Research on Innovation and Optimization of Superfine Brass Powder Manufacturing Process