金基合金

国际金基合金电镀概况（1967-1985）

A Review on Gold Alloy Plating Abroad ( 1967-1985 )

几种金基合金的耐磨特性

The Wear Resistance of several Gold Base Alloys

金基合金中钯的络合滴定

Complexometric titration of palladium in gold alloys

此方法用于多元金基合金中钯的测定，简便、准确、容易掌握。

The method has been applied to determine palladium in many-part gold alloy , which is simple , accurate and easy to operate .

介绍几种金基合金电镀的发展历程，比较几种镀液的性能特点并讨论几种金合金电镀的现况及未来的发展趋势。

The paper introduced the development of several gold-alloy plating , compared the character of several plating baths , and discussed present situation and development tendency for several gold-alloy plating .

稀土Y强化金基微合金研究

Research on the Strengthening Effect of Y on Au-Base Microalloy Black Gold

金基微合金强化研究

Research on the Hardening Gold Alloy with Trace Element

金基牙科铸造合金（Au-Ag-Cu-Pd系）成分与性能关系的研究

The Study on Relationship between Composition and Performance of Gold Dental Cast Alloy

可加工变形的新型金基形状记忆合金

A New Deformable Au-based Shape Memory Alloy

高合金化镍基变形高温合金中弯曲晶界的初步研究

A study of zigzag grain boundary in high alloyed wrought nickel-base superalloy