电镀铜

电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。

Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility , heat conductivity and ductility of copper deposit .

PCB电镀铜工艺和常见问题的处理印制电路板中通孔电镀铜添加剂的研究

Copper Plating Process for Printed Circuit Board and Disposal of Common Problems Research on acidic copper additives used in through-hole plating of PCB manufacture

两步电镀铜对Cf/Cu复合材料的复合效果的影响

The Influence of Two-step Electric Plating Copper on the Effect of Fabrication of C_f / Cu Composite

文章还对该类折叠波导慢波结构的微加工技术进行了初步的探讨，提出了基于ICP体硅深刻蚀、无电镀铜等组合工艺方案。

The fabrication technology is discussed and combined technologies based on ICP and electroless plating are presented .

论述了通过对等离子喷涂Al2O3涂层内电镀铜，利用镀入的铜在涂层断面上的分布，定量地测定涂层内粒子间结合的方法及结果。

The present paper describes the method to measure quantitatively the bonding between flattened particles in plasma-sprayed Al2O3 coating by utilizing the distribution of copper electroplated into the as-sprayed coating .

将所制得的盐基胶体钯应用到PCB化学镀铜和ABS塑料装饰性电镀铜中，获得性能优异的镀层。

The plating layer of nice quality was acquired when the salt-based colloid palladium had been used in activation step in the electroless copper plating on PCB and decorative copper plating on ABS plastic .

电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。

The plating copper is a key process in the production of PCB , which involves the quality assurance of metallization of PTH holes and laminate surface , and is affected by a number of factors .

研究了在碳粉表面电镀铜的工艺。

The process of copper metallizing of carbon powder was investigated .

酸性脉冲电镀铜中脉冲参数的作用研究

A Study on Pulse Parameters in Acid Copper Pulse Plating

印制电路板中通孔电镀铜添加剂的研究

Research on acidic copper additives used in through-hole plating of PCB manufacture

电镀铜薄膜界面结合强度及氧化性能的研究

Research on Interface Bonding Strength of Copper Electroplating Film and Oxidation Performance

焦磷酸盐电镀铜锡合金电极过程

On Electrode process of Electroplating Cu-Su Alloy with Pyrophosphate-Stannate

半导体硅上激光诱导选择性电镀铜

Laser Induced Selective Electroplating of Copper on Semiconductor Silicon

基于弹塑性有限元分析的电镀铜薄膜缺口疲劳断裂特性研究

Study on fatigue property of notched electroplated copper thin film based on FEM

电镀铜添加剂的合成及其电化学性能

Synthesis and Electrochemical Properties of a Copper Plating Additive

电镀铜－镍－铬故障处理一例

A Trouble Shooting Case in Plating Cu + Ni + Cr Coating Combination

电镀铜技术在电子材料中的应用

Applications of copper plating technology to electronic materials

硫酸盐酸性镀液中碳纤维电镀铜

Electroplating of Carbon Fibers in Sulfate Acidic Solution

影响酸性电镀铜用磷铜阳极质量因素的探讨

Discussion on factors affecting quality of phosphorized copper anode used for acidic copper electroplating

焦磷酸盐&锡酸盐电镀铜锡合金电极过程的研究

Electrode Kinetics of Cu-Sn alloy electroplating With Pyrophosphate-Stannate

碳纤维表面电镀铜

Copper Plating on the Carbon Fiber Surface

图形电镀铜的常见缺陷及故障排除

Common Defects Troubleshooting in Pattern Plating Copper

采用电镀铜充填盲导通孔工艺

Blind Via Filling Process Using Copper Plating

不同品质的焦磷酸盐对电镀铜的影响

Effect of pyrophosphate quality on copper electroplating

介绍了磷铜球的选择及使用要点，参与电镀铜反应机理；

This article introduces the selection and use of copper anode key principles , reaction theory .

焦磷酸盐电镀铜初始过程研究

Initial Process of Pyrophosphate Copper Electroplating

生铁铸件电镀铜锡合金

Cu-Sn alloy Electroplating on Iron Castings

线路板图形电镀铜针孔（凹坑）的形成原因及防治对策初探

Research on the reasons for and prevention measure of pit forming on PCB pattern acid copper plating

激光增强电镀铜

Laser enhanced copper plating

电镀铜着色新工艺

Coloring of Plated Copper