电子封装技术

本文提出了一种大批量层叠封装（PoP）组装方法，这种方法利用了倒装芯片组装中已有的电子封装技术。

This article proposes an approach to high volume Package-on-Package ( PoP ) assembly that leverages the existing electronics packaging technologies for flip chip assembly .

论文的各章节内容安排如下：第一章概述了电子封装技术的发展与研究现状，及LED红外探照灯的研究背景。

The materials discussed in this paper are organized as follows : In chapter 1 , the research developments of package technology are surveyed . And then , the research background of LED infrared ray light is introduced .

CSP技术是目前微电子封装领域中的研究热点之一，是未来高密度电子封装技术的主流和发展方向，有着非常广阔的应用前景。

The CSP technology is one of the hotspots in the domain of microelectronic , the mainstream and development direction to the future package technology . It has very wide application foreground .

随着当代电子封装技术的飞速发展以及无铅化潮流的兴起，倒装芯片中凸点（SolderBump）与凸点下金属层（UBM）之间的反应的研究成为当前研究的热点。

With the rapid development of electronic packaging technology and the rise of the lead free trend , the research of reaction between solder bump and under bump metallurgy ( UBM ) becomes a hot topic in flip chip tech - nology .

电子封装技术中金属基板结构的热失效行为研究

Study on the Thermal Failure of Metal Substrates in Electronic Packaging

几种电子封装技术在便携式电子产品中的应用

The Application of Several Electronic Packaging Technologies in Portable Electronics Products

高密度高性能电子封装技术

High Density and High Performance Electronic Package Technology

电子封装技术的快速发展对封装材料的性能提出了更为严格的要求。

The rapid development of electronic packaging technology has led to strict requirement for packaging materials .

电子封装技术的新进展

New Progress of Electronic Packaging Technology

高度发达的信息社会急需先进的电子封装技术，本文概述了电子封装技术的现状和发展趋势。

The state-of-the-art of modern electronic packaging technologies and its future trends are de-scribed in the paper .

现代电子封装技术

Modern Electronic Packaging Technology

为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。

Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication .

综述了电子封装技术的现状以及我国如何面对无铅化的问题。

The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland .

随着电子封装技术不断朝着微型化的发展，在检查倒装芯片封装和芯片规模封装中，声学微成像技术得到了极大的应用。

Because of the compact design of flip chips and CSPs in electronic packaging , acoustic microimaging has become extremely important for inspecting these packages .

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

With the development of electronic packaging technology , packaging pin number increasing , lead spacing smaller , encapsulated in the substrate of the area will be smaller .

最后概述高密度高性能电子封装技术的发展趋势&单芯片系统或系统级集成的前景。

The development trend of high density and high performance electronic packages , which is the single - chip system or the system - scale integrating , is reviewed last .

概述了目前主要的先进电子封装技术及发展趋势、电子封装材料的发展历程以及随着先进的封装形式和技术的不断更新，封装材料的发展方向；

The main advanced electronic encapsulating technology , its development trend , the development course of electronic encapsulating material and its heading direction along with the continual update of methods and technology were summarized .

焊点的可靠性问题是电子封装技术领域亟待解决的重要课题，是决定电子产品质量与发展的基本问题。

The problems about the reliability of the solder joint are important and urging to solve in the electronic package . The reliability of the solder joint decides the quality and development of electronic production .

为了满足这些要求，一方面需要在互连技术中引入低介电常数介质与铜金属互连线；另一方面，电子封装技术也面临着可靠性的巨大挑战。

According to these requirements , it is necessary to introduce the low-dielectric-constant ( k ) dielectrics and Cu for interconnection , and on the other side , packaging technique and reliability are also facing great challenges .

电子封装材料及其技术发展状况

The development of materials and technology of electronic packaging

电子封装中电镀技术的应用

Applications of electroplating technology in electronic packaging

这些日新月异的变化为电子封装与组装技术带来了许多挑战和机遇，但是电子封装与组装手动设备尚存在速度慢、精度低等问题，产品质量和产量也都无法保证。

These rapid changes in electronic packaging and assembly technology has brought many challenges and opportunities . Electronic packaging and assembly manual equipment , often there is the problem of low accuracy , product quality and output can not be assured .

电子封装微互连技术正在向小型化，高密度方向快速发展，微焊点不仅起着电气和机械连接的作用，还提供了散热的途径，因此微焊点的可靠性显得尤为重要。

Micro-interconnection technology in electronic packaging is rapidly developing to the orientation of miniaturization , high-density , the solder joint not only plays the role of electrical and mechanical connection , also provides a way to heat dissipation , so the reliability of micro-interconnection solder joint is very important .

系统封装（SystemInPackaging）是电子封装工艺的前沿技术。

System In Packaging SIP is a brand-new technology of electronics packaging .

概述了影响电子封装PCB结构的技术推动力。

This paper summarizes the technology drivers that impact packaging and PCB structures .

电子封装失效分析新技术&双波透射SAM

New Failure Analysis Technology for Microelectronics Packaging-Double Transmission SAM

复合材料的平均线热膨胀系数（20～100℃）随SiC含量的增加而减小，介于8.2～10.8×10~（-6）/℃之间，满足电子封装应用中的技术要求。

The mean linear CTE ( 20 ℃ - 100 ℃ ) of SiCp / Al composites , which lied between 8.2 - 10.8 × 10-6 / ℃, decreased as SiC content increased . This satisfied the technical requirements in electronic packaging .

电子束精密封装焊接技术

Electron Beam Welding Technology for Accuracy Packaging

布胶技术是广泛应用于电子封装行业的核心技术之一，布胶技术的发展将使集成电路的总成本大幅度下降。

Dispensing technology is one of the key technologies used widely in electronic encapsulation field , the development of dispensing technology will decrease the total cost of integrated circuit greatly .

本文介绍了电子封装的各种类型，综述了电子封装技术与封装材料的现状及发展趋势，重点讨论了高热导AIN基片金属化及AIN－W多层共烧工艺。

The types of electronic packaging are introduced and the current state and tendency of packaging technologies an materials are reviewed in this paper . The emphasis , is placed on the metallization of high thermal conductivity AIN ceramics substrates and AIN-W co-fired multilayer substrates .