波峰焊

传统的波峰焊存在漏焊、焊点拉尖、PCB变形等问题，回流焊存在温度过高，且两者成本都很高。

Conventional wave soldering exist leak welding , solder joint icicles , PCB deformation , etc. Reflow soldering temperature is too high , and both of them have a high cost .

无铅钎料的波峰焊有2个重要特点，钎料中Sn含量很高以及钎焊温度明显高于传统的Sn-Pb钎料。

There are two important characteristics in wave soldering with Pb-free solders , the using high Sn-content solder and the higher soldering temperature than the traditional Sn-Pb solder .

本文介绍了波峰焊技术及其PLC在波峰焊接机系统中的应用。

This paper introduces technology of wave-soldering and the application in wave-soldering system based on PLC .

本文介绍了波峰焊控制系统的总体设计和控制器的开发，并且在文中重点对基于继电反馈的PID控制参数自整定算法及纯滞后补偿控制算法进行了深入的研究。

The paper introduces the design of the control system of wave soldering machine and its controller .

波峰焊工作温度下Fe、Sn能反应生成主要为FeSn2的脆性针状化合物。

Operating under the temperature for wave soldering , Fe and Sn can react and create acicular brittle compound whose major element is FeSn_2 . The development of compound is not a balanceable process .

Sn-Bi-Ag-Cu钎料波峰焊焊点的剥离现象

Fillet-lifting phenomenon of wave soldering with Sn-Bi-Ag-Cu solder

采用在波峰焊过程中常用的Sn-Bi-Ag-Cu无铅钎料，进行了通孔波峰焊焊点剥离现象模拟实验。

The lift-off phenomenon in through-hole wave soldering with Sn-Ag-Cu-Bi solder was investigated by the simulation experiment .

波峰焊焊点有限元模型的建立与分析

Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model

能够独立解决与处理波峰焊产品工艺不良问题点。

Independently , can solve the process failure related with the WS .

感应式电磁泵波峰焊技术的发展及对环境保护

Development and Environmental Protection of Induced Electromagnetic Pump Wave Soldering

无铅钎料的波峰焊工艺与设备&挑战与对策

Wave soldering technology and equipment for Pb-free solders & challenge and countermeasure

熟悉波峰焊制程，熟悉组装和包装制程。

Familiar Wave soldering process . Familiar with assembly and packing process .

对波峰焊控制系统进行了现场调试。

Local debugging of the wave soldering control system .

波峰焊桥连产生的原因及预防措施

Causes and Countermeasure of Bridge Phenomenon in Wave Soldering

波峰焊，符合无铅焊接。

Wave soldering , compatible with lead free soldering .

好的管理和维护给波峰焊夹具，还有其他制程工具。

Good management and maintenance for wave pallet , and other process tooling .

适用再流焊与波峰焊；

Suitable for reflow and wave flow solder ;

波峰焊在国产化焊机印刷线路板焊接工艺中的应用

Application of Spike Welding in Welding Technology of Printed Substrate with Home Welding Machines

波峰焊常见问题及解决对策

Wave Soldering Common Question And Solution Countermeasure

有波峰焊经验优先。

Wave soldering experience will be preferred .

松香型波峰焊用活性助焊剂

Activated rosin flux for wave soldering

1950年代：通孔插装的群焊技术&波峰焊技术出现；

11950s : mass soldering for Through Hole Technology ( THT ) & wave soldering appeared ;

无铅波峰焊设备的特点

Lead-free Wave Soldering Equipment Characteristic

适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。

Apply to the high-grade circuit boards wave soldering , welding and hot dip high-grade iron tin wire .

从有铅到无铅波峰焊的转换过程中，由于钎料锡含量更高，导致波峰焊过程中氧化渣的产生量很大。

While , the more tin content in the Pb-free solder will lead to more dross during soldering process .

介绍了无铅波峰焊工艺的特点，并从波峰焊接工艺流程分别介绍了无铅波峰焊设备的各个子系统。

Introduce technology characteristic of lead-free wave soldering , and introduce each subsystem of lead-free wave soldering equipment according as technology process .

印制电路板的设计者为了波峰焊和浸焊后安装元器件方便，常常在印制板的焊盘上开槽。

The designers of Printed-circuit board usually make slots on the soldering plotes for mounting related components after waving soldering and immersed-soldering .

适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。

Tin spray applied to circuit boards , hot air leveling and wave soldering , welding and hot dip tin lead anyone .

以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。

This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint .

波峰焊的工艺特点决定了焊接过程中不断有新的液态钎料表面暴露在空气中，钎料在流动状态下发生氧化并形成氧化渣。

It is a feature of wave soldering that there is continuously liquid solder surface exposed to the atmosphere through out the soldering process .