无机黏结剂

  • 网络Inorganic binder;mineral binder bond
无机黏结剂无机黏结剂
  1. 无机黏结剂C颗粒经24h的水浸泡后,其崩解率为6.1%;

    After 24 hours ' wet steep , the granular disintegration rate of mineral binder ( C ) was 6.1 % ;

  2. 第三章研究了利用锐钛矿型二氧化钛浆料及无机黏结剂如低温釉和硅胶制备杀菌陶瓷;

    Anatase solution and inorganic agglutinant such as low-temperature glaze and silica gel were used to prepare antibacterial ceramic tile in the third chapter .