圆片

纯Ni圆片在原子氧环境中首先暴露30rain，使其表面充分活化形成一层NiO。

A virgin nickel disk was exposed to atomic oxygen environment for 30 min for full activation to form a layer NiO .

DCF型交流圆片瓷介电容器

Model DCF disk ceramic capacitor for AC application

裙子上点缀着无数亮闪闪的小圆片。

The frocks were covered in sequins , thousands of them .

黄瓜被切成了圆片。

A cucumber was sliced into rounds .

施主-可提供自由电子的搀杂物，使晶圆片呈现为n型。

Donor - A contaminate that has donated extra free electrons , thus making a wafer N-Type .

基于ANSYS的压电圆片振子径向振动模式分析

Analysis of Radial Vibration Modes of Round Piezoelectric Ceramics Based on ANSYS

IC生产线晶圆片冲洗甩干设备的开发和应用

The Development and Applications of Wafer Spin Rinse / Dryer in IC Production Line

Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用

Cu / Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS

MEMS圆片级气密封装微加热器阵列的设计和工艺研究

Design and fabrication of microheater array for MEMS wafer-level scale hermetic package

MEMS圆片级芯片尺寸封装研究

Study on Wafer - level Chip Scale Package for MEMS

总计指示剂数（IR）-晶圆片表面位面间的最短距离。

Total Indicator Reading ( TIR ) - The smallest distance between planes on the surface of the wafer .

目前商用的真空规由于体积大，无法应用于体积小的圆片级MEMS真空封装中。

Current commercial vacuum gauges cannot be applied in MEMS wafer level vacuum package for their big size .

MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究

Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging

而在苹果果实中，加入核酸和蛋白质合成抑制剂，反而增强了ABA对苹果果实圆片酸性转化酶活性的激活效应。

In grape berry acid invertase activity was suppressed and the inhibitors annulled ABA activation effects .

VLSI圆片级可靠性技术

VLSI Wafer Level Reliability Technology

VSD补片由两片被轴连接的圆片组成。

The VSD patch is composed of two discs connected by a thick shaft .

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3D堆叠式封装等。

Moreover , some major processes package of MEMS , including wafer-level packaging , single-chip packaging , multi-chip packaging and stacked 3D packaging , etc were discussed .

DMSO对马铃薯块茎圆片的透性、蛋白谱及多核糖体状况的影响

Effect of DMSO on Potato Tuber Segments in Permeability , Soluble Protein Patterns and Polysome State

质量保证区（QA）-晶圆片表面中央的大部分。

Fixed Quality Area ( FQA ) - The area that is most central on a wafer surface .

回顾当前IC制造中使用的清洗技术是如何减少、消除或避免晶圆片表面沾污的发展历史。

This paper reviews the wafer cleaning techniques used in the manufacturing of today 's ICs to reduce , eliminate or prevent contamination on the wafer surface .

低剂量SIMOX圆片表层硅缺陷密度

Dislocation Density in Top Silicon Layer of Low Dose SIMOX Wafer

采用压制成型制备的添加石墨成孔剂的圆片状Al2O3陶瓷支撑体具有较小的平均孔径（10μm左右）和较高的孔隙率（40%以上）。

Al2O3 ceramic wafer substrate had average pore size about 10 m and upper porosity over 40 % , which was added pore-forming agent of graphite and shaped by pressing .

光学邻近校正（OPC）系统要求一种精确、快速的方法来预测掩模图形转移到硅圆片的成像结果。

Optical proximity correction ( OPC ) systems require an accurate and fast way to predict how patterns will be transferred to the wafer .

厚度方向极化的圆片状压电换能器已经广泛地被用到声波成象测井仪和CET水泥胶结质量评价仪上。

A thin disc transducer polarized in thickness direction is widely used in ultrasonic imaging logging tool and CET logging tool .

再铸造8个直径为8mm、厚1mm的小圆片。

Eight wafers were cast with the same diameter of 8 mm and thickness of 1 mm .

以‘新红星’苹果果实为试材，采用果肉圆片孵育技术，研究了IAA、GA和ABA对SDH和SOX活性的影响以及二者之间的相关性。

The regulating effects of IAA , GA and ABA on activities of SDH and SOX were studied in the fruits of'Starkrimson'apple through disk incubation technique .

低剂量SIMOX圆片研究

Study of Low Dose SIMOX Wafer

300mm硅圆片的转移推动了半导体生产技术的进步

Transition to 300 mm Wafer Drives Progress in Semiconductor Processing

这两种低成本高可靠性的圆片级的封装将会给RFMEMS开关的封装带来巨大的改变。

These two wafer level packaging projects will have a big influence on the RF MEMS switches packaging , such as reducing the cost and raising the reliability of the RF MEMS switches .

压电泵采用多层粘结的圆片结构，包括PMMA（聚甲基丙烯酸甲酯）泵体、两个独立驱动的压电薄膜驱动器和三个弹性薄膜阀片。

The pump is a multi layer circular planar structure , consisting of PMMA ( polymethyl methacrylate ) pump body , two PZT actuator membranes and three cantilever valves .