光刻胶

SU-8胶是一种负性、环氧树脂型、近紫外线光刻胶。

SU-8 is a negative , epoxy type , near-UV photoresist .

通过光学功能薄膜、粘合剂、光刻胶和偏光片等的制作和在LCD显示面板制造中的用途，介绍了辐射固化技术在液晶显示器制作中的应用。

Through optical film , adhesive , photoresist and Polaroid making and applies for LCD screen making , UV-applications in LCD making is introduced .

用接触式显微术方法研究软X射线光刻胶特性

Photoresist performance studies using X ray contact microscopy

用于光刻胶刻蚀过程模拟的二维动态CA模型

A Two Dimensional Dynamic Cellular Automata Model for Simulation of Photoresist Etching Process

用光刻胶记录了水窗波段同轴X射线全息图，并以数字方法再现了原物像。

Soft X ray holograms within water windows are recorded in photoresist and reconstructed by using numerical technology .

光刻胶在LCD生产中的应用

Application of Photo Each Gluey in LCD Production

以钛酸丁酯和苯甲酰丙酮为原料，经SOLGEL工艺，获得具有负性光刻胶性质的TiO2光敏凝胶薄膜。

TiO_2 photosensitive gel films are derived from chemically modified metal-alkoxide with benzoylacetone by sol-gel process .

一种适于快速OPC的精确光刻胶剖面仿真算法

An Algorithm for Accurate Resist Profile Simulation of Fast OPC

用红外光谱（IR）法研究环化聚异戊二烯光刻胶发现，在1651cm~（-1）和880cm~（-1）处谱带的相对吸光度随环化度（CD）的增加而增大；

The cyclization degree ( CD ) of photoresist , cyclized polyisoprene was studied by infrared ( IR ) spectrometry .

采用缩短显影时间法改善了光刻胶热熔法制作微透镜阵列的工艺，提高了折射型微透镜阵列的F数（F）与填充因子。

The fill factor and F number of refractive microlens array fabricated by melting photoresist are increased by reducing developing time .

我们采用CFD技术对光刻胶研发实验室内的气流组织和微尘污染进行了研究。

The CFD method is used to study the airflow pattern and cross-contamination in a photo resistance research lab.

这篇论文是厚SU-8光刻胶接触式UV光刻后形貌的两维模拟。

The 2-D simulation of thick SU-8 photoresist profile after UV lithography is presented .

用于MEMS结构的光刻胶牺牲层接触平坦化技术凹面光栅型解复用器的通带平坦化设计

Contact planarization of sacrificial photoresist for MEMS application Design of the concave grating based demultiplexer with a flattened spectral response

实验研究一种新颖的光刻胶牺牲层的接触平坦化（contactplanarization）技术，应用于MEMS结构制作。

A novel contact planarization ( CP ) technology was utilized to planarize sacrificial photoresist for MEMS application .

DCPA光刻胶的软X射线感光灵敏度初步测量

Preliminary measurement of soft x-kay sensitivity of DCPA resist

在电极制作过程中，对Cu表面上覆盖的正性光刻胶的前、后烘烤温度及时间进行了研究。

During the course of making electrodes , the temperature and time for pre-bake and hard-bake of positive photoresist on the surface of Cu were studied ;

Eu（TTFA）3掺杂环氧基光刻胶薄膜的强烈红色荧光

Effective Red Fluorescence of Eu ( TTFA ) _3-doped Epoxy-based Photoresist Polymer Film

介绍了利用SU85光刻胶，采用UV曝光制备LIGA掩模板所涉及的SU85工艺研究结果。

The processing results related to fabricate LIGA mask using SU-8 5 resist and UV exposure system are reported .

这种技术利用氧化硅和光刻胶双层复合掩模来掩蔽厚铝的干法刻蚀，完全兼容于CMOS工艺；

This technique is fully compatible with conventional CMOS processes by employing silicon oxide and photoresist to mask thick aluminum film during dry etching .

SU-8光刻胶已成为制作高深宽比结构的首选光刻胶。

SU-8 photoresist has become the initial choice in manufacture of high-aspect-ratio microstructure .

SU-8胶是一种化学放大的、基于环氧基的负性光刻胶。

The SU-8 photoresist is a chemically amplified , epoxy based negative resist .

SU-8厚光刻胶已经成功地应用于高深宽比微结构的制作。

Thick SU-8 photoresist has been widely used to fabricate high aspect ratio structure .

降低SU-8光刻胶侧壁粗糙度的研究

Research of Reducing Sidewall Roughness of SU-8 Microstructures

主要提出了一种利用SU-8光刻胶形成高深宽比结构的新型压力传感器。

A novel pressure sensor based on a high-aspect-ratio structure formed by SU-8 photoresist is proposed .

利用SU-8光刻胶制备电铸模和微电铸工艺，制造了二维微执行器原型。

The prototype of the micro actuator is fabricated by means of micro electroforming and SU-8 photolithography techniques .

首先利用传统的光刻胶热熔工艺制作了平面微透镜阵列，然后利用深刻蚀（ICP）制作了一种硅岛阵列支撑结构，在硅岛上涂覆一层聚酰亚胺，并固化，形成柔性的结构。

Then a silicon island array supporting structure is manufactured by deep etching process . Finally a layer of polyimide is spun and cured on the silicon island array .

通过多次实验，摸索出了一组最优的微型杯设计参数以及相应SU-8厚光刻胶光刻工艺流程，按此流程制备出的微型杯阵列图形完好、线条清晰。

Through many experiments , a set of optimal micro-cup design parameters and the corresponding SU-8 thick photoresist lithography process were found .

与采用SU-8光刻胶电镀金属模具相比，此方法不存在光刻胶与衬底结合力差以及去胶难等问题，所制备的金属模具侧壁垂直，表面光滑。

The metallic mold insert prepared by this method shows smooth surface and vertical walls while without the difficulty of SU-8 removal .

着重讨论了157nmF2stepper的F2激光器、透镜材料、光刻胶和掩模材料问题。

We 'll focus our discussion on the F2 laser , the lens material , the lithography glue and the mask material for the 157 nm F2 stepper .

UV固化是辐射固化技术的一种，是快速发展的绿色新技术，广泛应用于光固化涂料、光刻胶、光固化油墨、电子封装材料等领域。

UV curing as a kind of radiation curing technology is the rapid development of " green " new technology , widely used in photocurable coatings , photoresist , photocurable ink , electronic packaging materials , and other fields .