qfn

Thermal Reliability Analysis for QFN based on Factorial Experimental Design

基于析因实验设计的QFN热可靠性分析

Reliability sensitivity analysis of the QFN device based on Monte Carlo method

基于蒙特卡罗法的QFN器件可靠性灵敏度分析

Influence of EMC Material Property Parameters on Thermal Stress of QFN

EMC材料特性参数对QFN器件热应力的影响

Finite element analysis on soldered joint reliability of QFN device

QFN封装焊点可靠性的有限元分析

Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method

基于CZM法QFN器件热冲击载荷下的界面脱层研究

Effects of Moisture on the Reliability of QFN Device in Hygro-Thermal Environment

湿热环境下吸潮对QFN器件可靠性的影响研究

Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

热–机械应力和湿气引起QFN器件层间开裂分析

Studying on the Coatings of QFN EMI Shielding by Using Electroless Cu Plating

QFN封装电磁屏蔽用化学镀Cu的研究

The effects of combining thermal-humidity and vapor pressure on delamination of plastic packaging QFN component

集成湿热及蒸汽压对塑封QFN器件的层裂影响

In this article , bonding pad design , stencil design and assembly process of QFN device will be introduced in detail .

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

The bonding force between the Cu deposition and substrate can reach 5B grade even after the thermal shock test and the cut by using high-speed grinding wheel of the QFN process .

镀铜层与基底间的结合力可以达到5B级，在经过热冲击试验和QFN封装工艺的高速砂轮线切割操作后，结合力都达到5B级。

Quad Flat No-lead ( QFN ) package of microwave chip is a relatively new packaging . It offers a small size and especially fits for high density printed circuit assembly .

QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。

The research in this thesis is supported by the National Natural Science Foundation Project . The structure and dimension parameters of Quad Flat no-lead package ( QFN ) devices has been optimized and analyzed .

本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。

The QFN package ( Quad Flat No-lead Package ), a new and developing technology for chip package , is a small footprint , low profile , surface mount , plastic encapsulated package with leads on the bottom .

QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。