QFP

Shape prediction and reliability analysis of QFP solder joint

QFP焊点形态预测及可靠性分析

Property and application of QFP multifunctional chemical conditioning agent

QFP多效化学剂的性能与应用

Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP

温度循环应力剖面对QFP焊点热疲劳寿命的影响

Effect of diode-laser parameters on tensile strength of QFP micro-joints

半导体激光钎焊工艺参数对QFP器件微焊点强度的影响

The 3D shape prediction models and the 3D finite element analysis models of all the 25 QFP solder joints were developed .

建立了这25种焊点的三维形态预测模型和三维有限元分析模型；

Mechanical properties and microstructures of QFP micro-joints soldered with diode-laser soldering system

QFP器件半导体激光钎焊焊点力学性能和显微组织

Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL .

主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响，得到一个最佳的氧含量范围。

In this paper , the geometry of solder joint of QFP is predicted according to the moist theory of liquid solder material and the principle of minimum energy .

本文根据液态焊料润湿理论和最小能量原理对QFP焊点的几何形态进行了预测。

The dissertation discusses the limitation of existing pattern match algorithms and proposes point pattern match algorithm to solve the image location problem with high-density pins IC such as QFP and BGA .

讨论了现有图像模板匹配算法在贴片机芯片定位应用中的缺陷，提出采用点模式匹配算法对QFP、BGA等高密度管脚芯片进行图像定位处理。

Specially , it ' svery significant to detect the three-dimensional appearance of QFP ( Plastic Quad Flat Package ) chips , because they are one of important IC chips .

QFP（PlasticQuadFlatPackage）芯片作为IC芯片的一种重要芯片，对其进行三维外观检测具有重大意义。

The tensile strength of soldered joints of QFP with pure lead is higher than that of eutectic solder and as well and as higher than that of eutectic solder itself .

共晶钎料QFP焊点的抗拉强度比纯铅的抗拉强度低，QFP焊点的结合强度比钎料自身的抗拉强度高。

Though PBGA packaging overcame the defect of QFP joints which the pitch is too fine , the detection method for the soldered joints of PBGA needs to be perfected .

PBGA封装（为塑料封装）克服了QFP焊点细间距的缺点，但是其焊点质量的检测方法研究仍未成熟。

Using ANSYS performed the nonlinear finite element analysis of the QFP solder joints under thermal cycles . The thermal fatigue life of QFP solder joint was calculated using Coffin-Manson equation based on the plastic strain .

对热循环加载条件下QFP焊点进行了非线性有限元分析，基于塑性应变采用Coffin-Manson方程计算了25种不同焊点形态的QFP焊点热疲劳寿命；

The conclusion can be obtained that the high-frequency EMC characterize of the BGA package is better than the QFP package by comparing the EMC simulation and the analysis of SI of these two kinds of package .

通过对两种封装进行电磁模拟及信号完整性分析对比，从中认识到，BGA封装的高频电磁特性明显优于QFP封装。

Soldering technology for quad flat pack devices ( QFP ) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power .

采用90W半导体激光软钎焊系统对方形扁平式封装器件（QFP）进行了焊接试验研究，并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。

QFP multifunctional chemical conditioning agent is a water-base chemical agent . It has good action for wax removal , paraffin inhibition , antiscale and demulsification . The paper discusses the property , mechanism and effictiveness of the chemical agent .

QFP型多效化学剂，是一种具有良好的清防蜡、防垢、破乳作用的水基型化学剂，文中探讨了该化学剂的性能、作用机理及效果。

With 90 % confidence the pad length has a significant effect on the reliability of QFP solder joints whereas the pad width , the stand-off and the stencil thickness have little effect on the reliability of QFP solder joints .

在置信度为90%的情况下，焊盘长度对QFP焊点可靠性具有显著影响而焊盘宽度、钢网厚度、间隙高度对可靠性无显著影响。

Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ) .

采用微焊点强度测试仪（STR-1000型）测试了方形扁平式封装器件（QFP）的抗拉强度，并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。