msdb

The liquid-state reaction time of MSDB is more similar to laser reflow .

与红外或热风重熔相比，MSDB的液固反应时间很短，与激光重熔更为类似。

Unable to grant MSDB permissions for target server .

无法授予对目标服务器的msdb权限。

Transient contact liquid-solid reaction between solder droplet and pad during MSDB was analyzed .

研究了MSDB过程中钎料熔滴与焊盘界面的瞬间接触液固反应。

By default , any logical folders that you add to MSDB are automatically included in the package store .

默认情况下，任何添加到msdb的逻辑文件夹将自动包括在包存储区中。

In the event that the external program cannot log to the MSDB tables , the program logs errors to the windows application event log .

如果外部程序无法将错误记录到msdb表，则会将错误记录到windows应用程序事件日志。

Through inspection of MSDB process , it can be found that initial temperature of solder droplet is the main influential factors for reliable bump .

针对MSDB的工艺研究发现，钎料熔滴初始温度是形成可靠凸点的主要影响因素。

There exists a lowest temperature , reliable MSDB bump can be achieved only when initial temperature of solder droplet is above this temperature .

获得可靠的MSDB凸点要求钎料熔滴初始温度必须高于一定的最低温度。

Molten solder droplet bumping ( MSDB ) is adapted to the requirement of high-density packaging and has distinctive advantages .

钎料熔滴凸点制作（MoltenSolderDropletBumping，简称MSDB）适应于高密度封装要求，有明显的优点。

However , it is a typical heat process in laser reflow while it is a purely temperature reduction process in MSDB . Liquid solder solidified before reaching temperature equilibrium .

但激光重熔有典型的钎料加热过程，而MSDB是单纯的钎料温度下降过程，液态钎料未达到温度平衡即完成凝固。