键合

功率LED芯片键合材料对器件热特性影响的分析与仿真

Analysis and simulation of thermal characteristic on die bonding materials of power LED

其在Si片表面生成的多孔结构氧化层有利于键合。

The oxide layer with porous structure is propitious to bonding .

C（18）反相硅胶键合相的制备与性能评价

Preparation and characterization of C_ ( 18 ) silica bonded phase

金属配合物对DNA的键合机理及其生物功能

Binding Mechanism of Metal Coordination Compounds for DNA and Their Biological Functions

结果表明亚甲基蓝可以与DNA发生强烈的作用，其作用模式为混合模式（主要为静电键合，沟槽键合）。

Interaction mode of MB with DNA were electrostatic attraction and groove-binding .

取代基型钌配合物电子结构及与DNA键合倾向研究

The Study on the Electronic Structures and Trend in DNA-binding of Substituted Ruthenium Complexes

菁染料共价键合在单晶硅表面的X－光电子能谱

X-photoelectron spectra of cyanine dyes with covalent binding to monocrystalline silicon surface

金属配合物键合DNA的研究进展

Progress of Metal Complex Binding DNA

电子封装Cu键合丝的研究及应用

Research and Application of Copper Bonding Wire in Electronic Packaging

基于Web的键合图法MEMS系统级多能量域仿真平台

Web Based Coupled Energy Domains Simulation Platform of MEMS : A Bond Graph Approach

全自动IC芯片键合机的结构设计及原理

Design and Principle of the Mechanical Structure of the Automatic Die-bonder

NO2、N2O4分子的空间构型和键合作用

Spatial Configurations and Bonding Effects of NO_2 and N_2O_4

IC引线键合引线轮廓成形仿真研究

Simulation Study of Wire Loop Profiling in IC Wire bonding

但是络合物活性和结构间的确切关系以及DNA和铂络合物的键合性质迄今仍不清楚。

But the exact structure-activity relationship and the nature of binding between DNA and platinum complex are not yet understood .

抗孕-53差向异构体的键合相正相HPLC分析与熔融温度测定

Bonded normal phase HPLC determination of ANORDRIN

Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用

Cu / Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS

MEMS器件封装的低温玻璃浆料键合工艺研究

Study on Low Temperature Glass Frit Bonding for MEMS Device

用于MEMS器件的单面溅金硅共晶键合技术

Au - Si Eutectic Bonding Technology for MEMS Device

Sol-Gel法制备键合型有机/无机复合非线性光学材料

Synthesis of bonded organic / inorganic nonlinear optical hybrid material by sol-gel technique

纳米非晶Si3N4固体结构和键合特征

Structure and bond characterization of the nanometer-sized amorphous silicon nitride solid

用于MEMS器件的键合工艺研究进展

Developing Trend of Bonding Technology for MEMS

激光在MEMS键合技术中的应用

Laser Applications in Bonding of MEMS

对CSP键合金丝的热可靠性进行了研究。

Thermal reliability of Au bonding thread in CSP was studied .

超声引线键合PZT驱动信号采集分析系统

A PZT driver signal acquisition and analysis system for ultrasonic wire bonding

医用TiO2/SiO2薄膜表面共价键合肝素研究

Covalent immobilization of heparin onto tio_2 / sio_2 films for biomedical applications

一种PMMA表面改性的热压键合方法研究

New Method of Layer-to-layer Bonding Technology of PMMA

SiO2钝化腹对硅／玻璃静电键合的影响

Role of SiO_2 Film in Si / Glass Bonding Technology

在钛表面涂覆羟基磷灰石（HA）可以显著提高钛的生物活性，实现钛植入体与骨组织的骨键合。

Hydroxyapatite ( HA ) coating on the titanium surface can be significantly improve the biological properties of titanium .

载带自动键合（TAB）引线技术

Tape Automated Bonding Technique

硅片键合制备SOI衬底

Preparation of SOI Substrate Using Wafer Bonding