铜箔

利用PLC实现铜箔收卷的PI控制

The PI Control of Winding in Copper Foil Production Based on PLC

基于PLC和触摸屏的铜箔后处理机控制系统设计

Design of the Control System Based on PLC and Touch Screen for the Post-processor of Copper Foil

X射线光电子能谱表明剥离强度的大小与铜箔表面的氮元素的含量高低有关。

X-ray photoelectron spectroscopy indicates peeling strength is related to content of nitrogen content in the copper surface .

简要阐述了用可编程控制器（PLC）实现对铜箔覆胶机自动控制的方法。

The copper clad laminate automation system is designed and realized by using Program Logic Controler ( PLC ) .

通过试验研究了铜箔（copperfoil）在渗硼处理中的防渗作用。

The permeation prevention with the copper foil has been done in the process of boronizing through the experiment .

同时能光滑尖锥状晶粒的峰尖，避免粗糙过度，但PEG过量会降低铜箔高温抗拉强度和延伸率。

But excess PEG will reduce the tensile strength and elongation of copper foil at high temperature .

该方法改变了过去铜箔覆胶机由继电器逻辑控制附加独立调节仪表实现控制的方法，采用PLC及工控机通过工业以太网构成完整的控制系统。

The relay and adjustable instrument control style is replaced by using PLC and Industrial Personal Computer ( IPC ), which adopts industrial ethernet .

基于PROFIBUS总线的铜箔后处理生产线传动系统

The Drive System of the Copper Sheet Post-processing Production line Based on PROFIBUS

基于Profibus-DP的高档铜箔生产工艺控制

Control of High Quality Copper Sheet Production Based on Profibus-DP

由于Cu的存在不仅大大降低六氯苯的脱氯温度，同时还提高了六氯苯脱氯的效率和完全性，因而可以在相对较低的温度下在铜箔上沉积单层石墨烯。

Owing to the presence of Cu not only greatly reduced the temperature of HCB dechlorination and also increased efficiency and completeness of dechlorination of HCB .

PCB是由树脂、玻璃纤维及铜箔等所构成的难加工复合材料，材料各向异性明显。

PCB is the difficult processing composite materials constituted by the resin , glass fiber and aluminum foil , its anisotropic is obvious .

本文介绍了覆铜箔层压板在其生产过程、检测过程与其在PCB生产过程中的各种影响因素及结果。

The article introduce that the kinds of factor and result of CCL in its Producing Process , Testing Process and PCB Producing Process .

信号传输高频化和高速数字化对PCB的挑战（2）&对覆铜箔板（CCL）的要求

The Challenge of Signal Transmission in High Frequency and High Speed Digitization ( 2 ) & The Requirements for CCL

结合高档铜箔的生产工艺，介绍了基于Profibus-DP的控制系统的设计及DP网络的组态方法和过程。

In this article , a control system based on Profibus-DP and the configuration of DP network are discussed .

新一代高耐热性、高模量、低CTE覆铜箔层压板材料

New Generation High Heat Resistance , High Modulus and Low CTE Copper Clad Laminates

探讨了铜箔上石墨烯CVD法制备原理，设计并搭建了本文的实验系统。

Also , the principle of synthesis of graphene on copper by CVD is discussed , and the experimental system is designed and built .

具体内容如下：首先，采用热蒸发法，首次在铜箔衬底的两个不相邻位置上一次同时制备了大量ZnO纳米线，而在其他位置上却没有ZnO生成。

The main contents are arranged as follows . Firstly , large-scale ZnO nanowires were first prepared on two nonadjacent positions of copper foil by thermal evaporation by one time .

本文从一些统计资料和有关信息，分析了我国印刷电路板（PCB）工业的发展趋势和铜箔的前景。

Statistic figures and relevant messages are analyzed with the purpose of forecasting the development trend of the PCB industry and prospects of copper foil industry in our country .

利用此实验系统，对微米尺度的多晶铜丝、单晶铜箔和GaAs薄膜分别进行了单向拉伸、疲劳加载和三点弯曲实验，并对材料的相关力学性能进行了测试和实验表征。

By using the testing system , monotonic and cyclic loading , three-point bending tests were performed for micron-scale polycrystalline Cu wires , single crystal Cu foils and GaAs films , respectively .

本文通过U型拉深实验研究了试样表面形貌、压边力、润滑方式和凹模槽宽尺寸对T2紫铜箔微小试样的拉深中摩擦的影响。

The influence of the specimen surface topography , blank holder force , lubrication conditions and groove width to friction in micro U-deep drawing was investigated in this paper .

要生产出适合于高密度电路板（HDI）使用的低轮廓电子铜箔更加困难和紧迫。

So to produce the suitable low profile electronic copper foil for high density circuit board ( HDI ) is more difficult and pressing .

电解铜箔主要应用于PCB电路板，随着电子行业的发展，需求量日益增多，性能要求也越来越高，超薄、低轮廓铜箔具有广阔的发展前景。

Electrodeposited copper foil have been mostly applied to PCBs . Along with development of electron trade , requiement increasing and demand of performance becoming higher . Ultra-thin and low profile foil is provided with wide development .

研究了一种新的印制板用电解铜箔后处理工艺，依次进行电镀Zn-Ni基三元合金、铬酸盐钝化、浸有机膜等。

A new post-treatment technics on electrolytic copper foil used for printed board was studied , including electroplating Zn-Ni based ternary alloy , chromate passivation , dipping for organic film .

PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关，设计时需考虑相关因素。

Equivalent heat conductivity of PWB is related to the thickness of PWB , the residual ratio of copper foil and the thickness of copper foil .

AXF系列电磁流量计在电解铜箔行业典型故障分析与解决

Analysis on Typical Failures of AXF Series Electromagnetic Flowmeter Used in Copper Foil Industry and their Solutions

本文采用0.1μs脉冲CO2激光快速加热厚度为微米量级的铝箔、康铜箔、氮化硼片样品，井使用参考激光束造成单缝衍射。

In this work , CO2 laser pulse of 0 . 1 μ s was used to heat instantly the thin specimens of Al . constantan , BN with the thickness of 20-100 μ m. and a system of the slit diffraction using He-Ne laser was also adopted .

HDI多层板覆铜箔板生产技术的应用与开发GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板

Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

采用铜丝编织带和铜箔连接的3种热桥进行对比实验，研究了热桥的传热特性对热耦合二级Stirling型脉管制冷机性能的影响。

To investigate the effect of heat transfer characteristics of heat bridge on the refrigeration performance of a thermally coupled two-stage Stirling-type pulse tube refrigerator , contrastive experiments with three types of heat bridge s were performed .

SEM观察表明，直接沉积在铜箔上的Co3O4为均匀的蜂窝状结构，而沉积在石墨上的Co3O4为非均匀的蜂窝状结构。

SEM results show that the Co_3O_4 phase deposited directly on the copper foil substrate has a uniform honeycomb structure , while the Co_3O_4 phase deposited on the graphite coating demonstrates a nonuniform honeycomb structure .

在电解铜箔上采用碱性焦磷酸盐体系电镀Zn-Sn合金，可改善铜箔表面的综合性能。

The combination properties of copper foil surface can be improved by electroplating Zn-Sn alloy on it using alkaline pyrophosphate system .