薄膜电路

薄膜电路中电阻与电容的制造研究

Research to the Fabrication for the Resistor and Capacitor in the Film Circuit

多层结构微波毫米波薄膜电路制作工艺研究

Technology of Multilayers Structure in Thin Film Microwave and Millimeter Wave Integrated Circuits

薄膜电路分布在袋表面内夹层，磁钮开关设置在袋盖处，总开关设置在袋隐蔽处。

The thin film circuit is distributed at an interlayer in a bag surface . A magnetic button switch is arranged at the point of a bag cover , and a main switch is arranged at a bag shelter .

CeO2-Y2O3电解质薄膜等效电路研究

Discussing on Equivalent Circuit of CeO_2-Y_2O_3 Thin Film

薄膜混合电路中有机薄膜厚度的快速测定

Determine the Thickness of Organic Films in Hybrid Integrated Circuit

集成电路有厚膜集成电路和薄膜集成电路。

The integrated circuit contain thick film integrated circuit and the thin film integrated circuits .

薄膜集成电路合金贴装常见问题分析

Alloy Assembly of Thin Film IC

薄膜晶体管矩阵电路中的Al电极

Aluminum Electrode in Amorphous-Silicon Thin Film Transistor Matrix Circuit

薄膜多层混合电路CAA中的器件模型和应用

Device Models and Their Application in Multilayer Thin Film Hybrid CAA

概述了薄膜多层混合电路计算机辅助电路分析（CAA）的原理和特点。

Principle and features of computer aided circuits analysis ( CAA ) in multilayer thin film hybrid are surveyed .

为了满足一定的击穿电压，薄膜SOI高压电路一般采用漂移区线性掺杂技术，但其工艺复杂，且自热效应严重；

For thin-film SOI-HVIC , linear drift region doping profile is adopted to satisfy a certain breakdown-voltage , but this process is too complex and its self-heating effect is obvious ;

薄膜或厚膜电路，仅由无源元件组成

Circuit , thin or thick film , consisting solely of passive elements

用再流焊技术组装薄膜混合集成电路

Mounting Membrane Combined IC with Reflow Soldering Technology

功率器件在薄膜混合集成电路上的应用

Application of Power Devices on Thin Film HIC

这些研究对高温超导薄膜在微波电路中的应用提供了有利的帮助。

These results are useful for the application of the HTS film in microwave circuits .

该模型主要是针对无机薄膜晶体管的电路仿真模型。

This model is mainly directed against the Inorganic Thin Film Transistor Circuit Simulation Model .

铝导带薄膜混合集成电路工艺

Al Conduction Band in Thin Film HIC

薄膜混合微电路返工工艺研究

Rework technology for tin film HIC

随着现代光学、薄膜与集成电路技术的高速发展，光学零件与电子器件对表面质量的要求越来越高，很多要求达到超光滑表面。

With the high speed developing in the present optics , film and integrated circuit ( IC ) field , the optical elements and electrical devices have higher and higher demand of the surface quality such as super-smooth surface .

MOCVDTiN薄膜在先进集成电路制造中应用的研究

Study of MOCVD TiN in Advanced Semiconductor Manufacturing

氢化非晶硅薄膜对C-MOS集成电路的钝化保护作用

The Passivation and Protect Effect of α - Si : H Films on C-MOS ICs

薄膜材料在集成电路、光电子技术、微结构传感器等微电子元件的应用日益广泛，其导热性能直接影响元器件的热噪声，进而对其可靠性和使用性能产生明显影响。

Thin film materials have been widely used in micro electronic devices such as integrated circuits , photo-electron devices and microstructure sensors . Heat conduction behavior of these kinds of materials has direct influence on the thermal noises and hence the reliability and performance of the devices .