聚酰亚胺树脂

  • 网络Polyimide;polyimide resin
聚酰亚胺树脂聚酰亚胺树脂
  1. BMP系列热固性聚酰亚胺树脂基复合材料的应用进展

    Application Progress of BMP Thermosetting Polyimide Resin Matrix Composites

  2. 航空发动机用PMR聚酰亚胺树脂基复合材料

    High-temperature polyimide composites and its application in aeronautical engine

  3. 以顺丁烯二酸酐封端的PMR聚酰亚胺树脂的研究

    The study of PMR Polyimide by using maleic anhydride as endcap

  4. BTDE/PMDE共聚PMR聚酰亚胺树脂研究

    Research on btde / pmde copolymer PMR polyimide resin

  5. PMR型聚酰亚胺树脂基复合材料研究及应用

    PMR-Type Polyimide Matrix Composites and Their Applications

  6. 本文研究了玻璃纤维(MW100)/聚酰亚胺树脂(BMP350)复合材料的物理性能、介电性能、耐热性能。

    The physical , electrical and heat-resistant properties of polyamide resin ( BMP350 ) / M-glass ( MW100 ) composites are studied in this paper .

  7. 反相离子对抑制色谱法分析聚酰亚胺树脂溶液单体成分

    Analysis of Polyimide Resin by Reversed Phase Ion Pair Suppression Chromatography

  8. 双环[2.2.1]庚-5-烯-2,3-二羧酸酐封头的聚酰亚胺树脂及其复合材料

    Bicyclo [ 2.2.1 ] hept-5-ene-2,3-dicarboxylic anhydride capped polyimide and Its Composites

  9. 高性能聚酰亚胺树脂热固化过程及热分解机制的研究

    Thermosetting process and thermal degradation mechanism of high - performance polyimide

  10. 马来酰亚胺侧基聚酰亚胺树脂的制备及性能研究。

    Preparation and performance study of polyimide resin with maleimide side groups .

  11. 碳纤维/聚酰亚胺树脂基复合材料开孔件的连接力学性能

    Joint Mechanical Properties of Open-Hole Carbon Fiber Reinforced Polyimide Composites

  12. 聚酰亚胺树脂结合剂金刚石砂轮的制造与应用简介

    A briefing of manufacturing and application of polyimide resin bond diamond wheel

  13. 乙炔封端聚酰亚胺树脂及其碳纤维增强复合材料的研究

    Study of Acetylene-terminated Polyimide Resin and Carbon Fibre Reinforced Composites

  14. 聚酰亚胺树脂是一种耐高温、高强度的工程塑料。

    The paper introduces polyimide resin and its wheel 's manufacturing and application .

  15. KH-304热固性聚酰亚胺树脂及其碳纤维复合材料高温热稳定性的研究

    The Thermal Decomposition Behaviour of PMR Polyimide Resin and Its Carbon Fiber Composite

  16. 研究环氧树脂聚酰亚胺树脂凝胶行为的新方法

    A new method for the gelation behavior study on epoxy and polyimide resins

  17. 聚酰亚胺树脂和酚醛树脂在干湿条件下的磨削试验

    Performances of polyimide resin and phenolic resin under wet and dry grinding conditions

  18. 聚酰亚胺树脂合成及应用研究的新进展

    New progress on synthetic and application of polyimides

  19. 高韧性异构聚酰亚胺树脂及其复合材料

    High Toughness Isomeric Polyimide Resins and Their Composites

  20. 聚酰亚胺树脂固化动力学参数研究

    Study on curing kinetic parameter for polyimide resin

  21. 耐371℃PMR&Ⅱ型聚酰亚胺树脂化学反应特性的研究

    Study on Chemical Characteristics of High Temperature ( 371 ℃) Resistant PMR - ⅱ Polyimide Resin

  22. 无机组分改性聚酰亚胺树脂基体的制备

    Preparation of inorganic hybrid polyimide resin

  23. 在众多高性能复合材料基体树脂中,聚酰亚胺树脂因具有优异的耐高温性能而得到了广泛关注。

    Polyimide resin , which received widespread attention , has excellent comprehensive properties such as resist to high temperature .

  24. 氰酸酯树脂是继环氧树脂、双马来酰亚胺树脂和聚酰亚胺树脂之后发展起来的一种高性能热固性树脂。

    Cyanate ester resin is a kind of high performance thermosetting resin and developed after the epoxy resin , bismaleimide and polyimide resin .

  25. 一种新型苯乙炔封端聚酰亚胺树脂基体及其碳纤维复合材料的研究马来酰亚胺封端的叔丁基侧基聚酰亚胺合成和应用研究

    A Novel Phenylethynyl-terminated Polyimide Oligomers and the Carbon Fibre Reinforced Composites Synthesis and Applied Research on Maleimide-Terminated Oligomers Derived from 1,4-bis ( 4-aminophenoxy ) - 2-t-butylbenzene

  26. 介绍了高频高性能覆铜板对基材的性能要求,详细讨论了聚苯醚树脂、氰酸酯树脂及聚酰亚胺树脂的特性,并简要介绍了各种树脂基覆铜板的应用情况。

    The requirement of matrix resin for the high frequency and high performance copper clad laminate was introduced and polyphenylene ether resin , cyanate resin and polyimide resin were also discussed in detail .

  27. 综述了日本近年在印制电路板基材中热固性树脂的发展,其中包括:环氧树脂、酚醛树脂、聚酰亚胺树脂、热固性聚苯醚树脂,氰酸酯树脂和特殊热固性树脂。

    Development of thermosetting resins for printed circuit boards in Japan was reviewed in this paper . There were epoxy , phenolic , polyamide , thermosetting polyphenylene oxide , cyanate and other special resins .

  28. 由于聚酰亚胺树脂耐热温度高和耐磨性好,由它制作的金刚石微粉抛光片具有使用寿命长、磨削效率高和被加工工件的表面粗糙度低等优点。

    Because of the high heat resistance and good wear resisting properties of polyimide , the polishing pills made by it show significantly improved wear life , a better glass removal rate and a superior workpiece surface finish .

  29. 结果表明:杂化薄膜形成了有机相包裹无机相的结构,无机微粒比较均匀地分散在聚酰亚胺树脂基体中,粒径较大,树脂热性能好,电击穿性能有一定提高。

    The results prov that there was a structure of organic phase wrapping inorganic particles which dispersed in the polyimide matrix homogeneously and compared with the pure polyimide matrix , the polyimide hybrid resin had a better property of dielectric breakdown , except for a good thermal stability .

  30. 聚酯酰亚胺是一种改性的聚酰亚胺树脂,以其优异的电性能、热性能和机械性能,广泛应用于液晶显示、柔性印制电路、绝缘电线涂料、太阳能电池、感光材料和生活等领域。

    Poly ( ester-imide ), a kind of modified polyimide , are widely used in liquid crystal display , a flexible printed circuit , insulating wire coatings , solar cells , light-sensitive material , life and other fields because of excellent electrical properties , thermal properties and mechanical properties .