耐热聚合物

近年来随着微电子工业的发展，要求发展超薄耐热聚合物薄膜，尤其是聚酰亚胺（PI）超薄薄膜。

Microelectronics need superthin film of heat resistant polymers , particularly PI superthin film .

就利用液晶聚合物特性的新材料开发，对高循环成型材料和流动性和机械物性同时改性的填料应用、耐热新规格聚合物的骨架、精密成型材料及其回收再生适应性作了说明。

The article explains the new material development which using special property of liquid crystal polymers , it contains high cycle molding material , usage applying filler for simultaneously modifying flowability and machine physical property , new grade polymers skeleton with heat resistance , precision molding material correspondence with regeneration .

杂化纤维的耐热性能优于纯聚合物的耐热性能。

The hybrid fibers show better resistance to heat than pure polymer . 4 .

聚酰亚胺是迄今为止在工业应用耐热等级最高的聚合物材料，是一种重要的工程塑料，已在航天航空、电子电气等多项产业中得到广泛应用。

Polyimide ( PI ), as a typical kind of engineering polymer material with highest thermal stability hitherto , has widely been used in the aviation and microelectronic industries because of its outstanding performances .