粉末液相烧结

采用粉末冶金液相烧结工艺制备了Si-50%Al（质量分数）电子封装材料。研究了压制压力、烧结工艺对材料微观组织及性能的影响。

Si-50 % Al ( mass fraction ) electronic packaging materials were fabricated by liquid phase sintering .

综述了添加元素对奥氏体不锈钢粉末压坯液相烧结行为及材料性能的影响。

The paper summarizes the effect of additives on the liquid phase sintering behaviour of the compact of austenitic stainless steel powder and the properties of resultant material .

奥氏体不锈钢粉末压坯的液相烧结

Liquid phase sintering of the compact of austenitic stainless steel powder

在考虑真实粉末压块的液相烧结机制时，应研究液相的流动和分布。

In considering the mechanism of liquid phase sintering ( LPS ) in real powder compacts , liquid flow and distribution should be studied .

在保证粉末部分熔化的液相烧结机制的前提下，适当增加激光功率或减小扫描速率，有利于提高烧结致密度及组织均匀性。

Under condition that the mechanism of liquid phase sintering with partial melting of the powder prevails , increasing laser power or decreasing scan speed can generally improve sintering density and structural homogeneity .