环氧塑料

真空造型法制作环氧塑料铸模

Making epoxy plastics patterns in vacuum molding

文摘：原有的环氧塑料落压模在使用过程中模具型面脆裂变形严重。

Abstract : The epoxy plastic ( EP ) moulding surface of drop hammer die seriously presented embrittlement and deformation while drop pressing .

热固性塑料是指在受热或其他条件下能固化或具有不溶（熔）特性的塑料，如酚醛塑料、环氧塑料等。

Thermosetting plastic is defined as heat or other conditions can be solidified or insoluble ( melt ) properties of plastics , such as Bakelite , epoxy plastic .

采用热模压法制备了环氧模塑料（EMC）。

The epoxy molding compounds ( EMC ) was prepared by hot pressing molding method .

研究了将导电聚吡咯（PPy）薄膜制备在绝缘环氧模塑料（EMC）电子封装材料表面的方法，及导电PPy薄膜的电磁屏蔽效能。

The method of polypyrrole ( PPy ) films being synthesized on the surface of insulating epoxy molding compound ( EMC ) electronic packaging materials and the shielding effectiveness of PPy film were studied .

研究了在环氧树脂塑料封装材料表面制备导电聚吡咯（PPy）薄膜的化学聚合方法，分析了影响聚吡咯薄膜微观形貌、附着力及电导率的因素。

Polypyrrole film was prepared on the surface of epoxy resin plastic electronic packaging materials by chemical polymerization method . Effect factors of micro-morphology , adhesion and conductivity of polypyrrole film were analyzed .

沥青基碳纤维增强环氧模塑料的摩擦磨损性能

Friction and Wear Properties of Carbon Fiber Reinforced Epoxy Molding Plastic

一类新型高导热环氧模塑料的制备

Preparation of New Type Epoxy Molding Compounds with High Thermal Conductivity

环氧电工塑料的固化反应动力学研究

Study on the curing reaction kinetics of epoxy electrician molding compound

环氧模塑料和聚酯模塑料在线圈封装中的应用

Application of epoxy molding compound and polyester molding compound on coil packaging

复合陶瓷颗粒/环氧模塑料的制备与性能

The Preparation and Properties of Epoxy Molding Compounds Filled with Multiple Ceramic Particles

碳纤维增强环氧模塑料的研制

Development of carbon fiber reinforced epoxy molding compound

绝缘环氧模塑料表面导电聚吡咯薄膜的化学聚合与表征

Chemical Synthesis and Characterization of Conducting Polypyrrole Films on Insulating Epoxy Resin Substrate Surface

分析影响环氧模塑料弯曲性能测试的主要因素

Analysis on Main Factors That May Influence The Flexural Properties Data in The Test of EMC

废环氧模塑料粉；

Waste Epoxy Molding Compound Powder ;

本论文是在环氧树脂塑料封装基底表面利用化学镀铜方法制备电磁屏蔽薄膜的研究。

The process of electroless copper plating on the epoxy resin used to electronic packaging is studied in this thesis .

核壳橡胶在环氧模塑料中分散及增韧改性研究

Study of the Dispersion and Toughness on the Epoxy Molding Compound with Core-shell Elastic Particles plastic dual in line package

此外，环氧模塑料表现出应变硬化特征，即流动应力随应变增加而增加的现象。

Further more , EMC has properties of strain hardening , i.e. the flow stress increases with the increase of strain .

环氧树脂塑料中的云雾效应具有应力&光学的双折射性质。液晶双折射效应的再研究

The mottle existing in the plastics from epoxy resin possesses the behavior of birefringence . Further Research on Electro-optical Characteristics of Liquid Crystals

内嵌金属导热通道环氧模塑料导热性能与模拟碳纳米管/导热硅脂复合材料的导热性能

Thermal Conductive Performance and Thermal Simulation of High Thermal Conductive Epoxy Molding Compound Thermal Conductivity of the Carbon Nanotube / Silicone Grease Composite

利用水泥、环氧类塑料铺设的整体式防静电地坪，是保证防静电设计良好的重要方式之一。

It 's one of the important things to ensure good design of keeping anti electrostatics by using ensembled anti electrostatics floor paved by concrete or epoxy plastics .

综述了降低环氧模塑料封装中由于热膨胀系数不匹配产生的内应力的三种主要途径，即加入填料、改变基体树脂的结构和引入弹性体。

Three methods , including adding fillers , improving the structures of matrix resins and introducing elastomers , for reducing the internal stress of epoxy molding compounds for the encapsulating of large integrated circuits are reviewed .

研究结果表明环氧模塑料在准静态试验条件下，体现出脆性性质；在动态试验中随着应变率的增加，材料的屈服强度和流动应力有显著的提高，材料表现出应变率效应。

Compared with quasistatic tests , the results indicate that EMC has fragility in quasistatic experiments , while in dynamic experiments , the yield strength and flow stress increase remarkably with the increase of strain rate . Therefore , EMC has effects of strain rate .

本文对引线框架铜合金表面氧化物生长动力学、形貌、成分及铜合金与环氧树脂模塑料（EMC）黏结强度进行了研究。

The growth dynamics , morphology , composition of oxide on copper alloys are investigated , the adhesion shear strength of mound component on copper alloys is also studied .

集成电路封装用环氧树脂模塑料性能影响因素研究

Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging

低温快干环氧丙烯酸氨基塑料漆

Low-temperature Quick-dry Epoxy Acrylic Amino Coatings for Plastics

模压成型纤维增强环氧片状模塑料的研究

Study on Fiber Reinforced Epoxy Sheet Molding Compound

压电纤维复合材料桨叶的动力学建模模压成型纤维增强环氧片状模塑料的研究

Dynamic modeling of composite rotor blade with piezoelectric fiber Study on Fiber Reinforced Epoxy Sheet Molding Compound

如果将石墨烯放入其他的材料中，比如环氧树脂或塑料，就可以得到很轻但很结实的材料。这对于卫星和飞行器来说很有吸引力，它同时可以用来制作柔性电子产品。

If you put graphene into other materials , such as epoxy or plastic , you can make very light and very strong materials , which is interesting for satellites and aircraft , but its also that you can make flexible electronics .

改性酚醛型环氧玻璃纤维压塑料的研制

Preparation of glass fiber reinforced modified novolac & type epoxy resin molding compound