激光打孔技术

激光打孔技术激光打孔技术
  1. 本文首先介绍了高密度PCB材料以及激光打孔技术在国内外的发展情况。

    This article first describes the high density PCB materials and laser drilling technology in domestic and international developments .

  2. 利用超短脉冲激光打孔技术制备金属膜的探索

    Exploration on Producing Metal Membrane with Technology of Ultra Short-Pulse Laser Drilling

  3. 小锥度激光打孔技术研究

    The Technology Study of Small Taper Laser Drilling

  4. 高质量激光打孔技术的研究

    Research on the Laser Drilling of High Quality

  5. 目前一般都采用激光打孔技术来在药片表面打孔,释药孔的尺寸一般都是毫米级别甚至微米级别的。

    Recently , the drug-release holes are generally drilled by using the laser drilling technology and the sizes of the drug-release holes are commonly on the scale of millimeter or even micrometer .

  6. 高峰值功率激光脉冲组打孔技术

    Drilling by Using High Peak Power Laser Pulse Group

  7. 详细介绍了塑料的激光焊接技术、激光打孔技术、激光标志技术和激光切割技术的应用技术、方法特点和发展趋势。

    In detail introduced the plastic laser welding technology , drill a hole with laser technology , the application technology of the laser symbolized the technology and the laser cut technical , the method characteristic and the development tendency .