半导体的压阻效应

研究了半导体的压阻效应、压阻张量、压阻系数，进而对MEMS悬臂梁进行了受力弯曲分析，分析压敏电阻的设计位置。

Piezoresistive effect of semiconductor piezoresistive tensor and the piezoresistive coefficient are studied . MEMS cantilever bending force is analyzed , and the location of the varistor is design .

压力传感器利用的是半导体的压阻效应，通过微机械加工技术制作而成。

Pressure sensor made by micro-machining technology and based on the semiconductor piezoresistive effect .

利用半导体材料的压阻效应和良好的弹性，用集成电路工艺和硅的微机械加工技术来研制固态半导体压力传感器，此种传感器主要有硅压阻式和电容式两种。

Make use of the capability of semiconductor material with pressure resistance and the better flexibility , to study and manufacture the solid pressure sensor of semiconductor with the integrated circuit craft and the micro engine processing technology , it has two major kind , silica pressure resistance and capacitance .