ulsi

The Engineering Maintenance of ULSI Design Software

超大规模集成电路设计软件的工程化维护

Low k Materials for ULSI Application

低介电常数材料在超大规模集成电路工艺中的应用

Material Removal Mechanism and Model on Chemical Mechanical Polishing in ULSI

ULSI化学机械抛光（CMP）材料去除机制模型

The Study on the Delay Time for the Interconnection in ULSI

ULSI中互连线延迟时间的研究

Study on low k fluorinated amorphous carbon films used in ULSI

用于ULSI的低k氟化非晶碳膜研究

Thermal analysis of multilevel metal routing in 0.1 μ m ULSI Technology

0.1μmULSI工艺中多层金属布线的热分析

Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI

超大规模集成电路制造中硅片化学机械抛光技术分析

Nowadays , CMP technology has been widely used in ULSI manufacturing .

目前，CMP技术已成为ULSI时代最广泛使用的平坦化技术。

Deep sub-micron ULSI process measurement : Scanning probe microscope technology

深亚微米ULSI工艺检测技术&扫描探针显微镜

The Study on the Reliability of the Copper Interconnection in ULSI

ULSI中铜互连线可靠性的研究

A Design Method of Fast Timing Convergence for 0.18 μ m ULSI Chips

一种0.18μm特大规模芯片快速收敛的设计方法

Analysis and Study on the Influencing Factors of Copper Interconnection CMP in ULSI

ULSI多层铜布线CMP影响因素分析研究

Study on fluorinated diamond - like carbon films for ULSI

ULSI用氟化类金刚石薄膜的研究

Analysis of Hot Spots in ULSI Interconnect and Via Systems

ULSI中金属互连系统上的热点分析

A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects

一种新型的集成电路金属连线温度分析解析模型

Research and Prospects of Chemical Mechanical Polishing for ULSI

ULSI化学机械抛光的研究与展望

Technology Analysis on Copper CMP Slurry in ULSI Manufacturing

ULSI制造中铜CMP抛光液的技术分析

Study on Controlling the Concentrations of Dissolved Oxygen and Total Organic Carbon in Water Used for ULSI

控制超大规模集成电路用水中的溶解氧和总有机碳浓度的研究

State of the arts Cu interconnect and its reliability in ULSI

ULSI中铜互连及其可靠性的研究与进展超大规模集成电路的平坦化技术

Numerical Simulation of Thermal Stress in Al Interconnects of ULSI / VLSI

ULSI/VLSI中铝互连线热应力的数值模拟

A Study of the Technology of Ultra-thin Film SOI and the Development of Micro ULSI

超薄膜SOI技术与深亚微米ULSI的发展

Analysis and Study on CMP of Copper Interconnects for ULSI

用于ULSI铜布线的化学机械抛光分析

ULSI Architecture Design Methodology on DSP Algorithms

DSP算法ULSI架构设计方法学

Mechanism of copper interconnection CMP in ULSI was studied .

研究了ULSI多层互连工艺中铜布线的CMP的机理；

Various CVD technologies for preparing low dielectric constant materials in ULSI circuits are summarized .

综述了制备ULSI低介电常数材料的各种CVD技术。

Corrosive Wear Analysis of the Copper Chemical-mechanical Polishing in ULSI Manufacturing

ULSI制造中铜化学机械抛光的腐蚀磨损机理分析

Chemical Mechanical Polishing of Silica Dielectric in ULSI Manufacturing

ULSI制备中SiO2介质的化学机械抛光

Study of CMP Technology for Tungsten Plug in ULSI

IC制备中钨插塞CMP技术的研究

Technology and Slurry of Barrier CMP in ULSI with Cu Interconnection

集成电路多层铜布线阻挡层CMP技术与材料

CMP Study of Multilayer Wiring Conductor Copper in ULSI Manufacturing

ULSI制备中多层布线导体铜的抛光液与抛光技术的研究