tsop

Application of TSOP Sand Control Technology in the Shengli Oilfield

TSOP防砂技术在胜利油田的应用

All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP .

所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。

However , for a small chip TSOP , a compound thickness ratio of 2.0 ~ 2.9 reduces the warpage .

对小芯片TSOP而言，化合物厚度比为2.0～2.9，减轻了封装翘曲问题。

In this thesis , molding process for a typical TSOP product is studied in detail , and FEA ( Finite element analysis ) has been applied in this process .

本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。

In this article , different combinations of finite element and calculating methods were used to investigate the best method for predicting the thin small outline packages ( TSOP ) warpage .

把有限元和各种计算方法进行不同地结合，是研究预测薄型小外形封装（TSOP）翘曲问题的最佳方法。

Two-sided constrained optimal path ( TSOP ) algorithm was proposed to maintain high utilization of network resources and ensure the new adding VC-n to satisfy the differential delay constraints .

为优化网络资源，并保证新加虚级联组成员的相对延迟在系统允许的范围内，提出了双向约束路径优化算法（TSOP）。