bga

Research on Image Locating Algorithm with BGA Package Based on Point Pattern Match

基于点模式的BGA芯片定位算法研究

Analysis on Thermal Stress and Thermal Reliability of BGA Packaging

BGA封装的热应力分析及其热可靠性研究

Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

BGA焊点的形态预测及可靠性优化设计

This paper introduces vision inspection technology into BGA ball mounting machine .

集成电路粘片机视觉检测技术研究本文介绍了视觉检测技术在BGA植球机上的应用。

Finite Element Analysis on Solder Joint Stress of BGA under Shock Load

冲击载荷下BGA焊点应有限元模拟

A New High Density Mount Technology & BGA

崭新的高密度组装技术&BGA

Application of Fuzzy-PID in the Temperature Control System of BGA Rework Station

模糊PID在BGA返修站温度控制中的应用

Mechanical Test and Analysis on the Reliability of Lead-Free BGA Packaging

无铅BGA封装可靠性的力学试验与分析

In this paper , the technology of BGA defect detection is studied systematically .

为此，本文系统的研究了BGA缺陷检测技术。

Analysis Of Applying CCD To Measure Three-Dimensional Size of BGA Pin

CCD在BGA管脚三维尺寸测量中的应用分析

Formation Mechanism of BGA Void and Effects on Solder Joint Reliability

BGA空洞形成的机理及对焊点可靠性的影响

A Improvement Method On Segmentation And Extraction of BGA Joint by Mathematical Morphology

基于数学形态学BGA焊点分割和提取的改进方法

Effect of BGA Solder Joint Void on Signal Transmission Performance

BGA焊点空洞对信号传输性能的影响

Defect Analysis and Process Improvement of BGA Solder Joint

BGA焊点的缺陷分析与工艺改进

Defects inspection and MATLAB realization of BGA chips based on machine vision

基于机器视觉的BGA芯片缺陷检测及其MATLAB实现

BGA Technology and Quality Control

BGA技术与质量控制

BGA Assembly Technology Research for Solder Ball 's Reliability

对BGA封装技术中锡球焊接可靠性的研究

Research for Flip - Chip BGA Technology to Avoid Cracking

避免发生芯片裂纹的倒装片BGA技术概述

Applications of Automated Process Control for BGA Packaging

用自动化过程控制技术解决BGA封装难题

Vision Detection and Locating Algorithm and Realization of BGA Package Based on Point Pattern Matching

基于点模式匹配的BGA芯片视觉检测与定位算法及其实现

Defects Inspection and MATLAB Simulation of Chips BGA Packages Based on Machine Vision

基于机器视觉的芯片BGA封装焊球缺陷检测及MATLAB仿真

Three dimensional Measuring Technology for BGA Chip Leads

BGA芯片管脚三维尺寸测量技术

The Design of Micro Stored Testing and Measuring System Based on BGA / CSP Packaging Technology

基于BGA/CSP封装技术的微型存储测试系统的研制

The Effect of Process Condition on Electrical Property of Solder Joint in BGA Assemble

工艺条件对BGA焊点电性能的影响

BGA Device and Soldering Second , the terminal is designed .

BGA元件与焊接然后完成了嵌入式车载监控终端硬件结构设计。

Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test

BGA焊点在板级跌落实验中的疲劳寿命估计

Application of Infrared Heating Technology to BGA Rework Soldering Center

红外加热技术在BGA返修焊接中心的应用

BGA Solder Joint Defects Image Processing Method Based on 2D Imaging by Radiographic Real Time Testing

基于2D投影的BGA焊点X射线检测缺陷图像处理方法

Vision inspection technique and application of full-automatic BGA mounting machine

BGA全自动植球机视觉检测技术及应用

Research on Technology of Fabricating Solder Ball for BGA Packaging

BGA封装锡球制备技术研究