Warpage

Grid Algorithm Based on Approximate Function for Injection Warpage Optimization

基于近似函数的注塑翘曲优化网格算法

Analysis and application of warpage for injection product

注塑产品的翘曲分析及改进

The Research on Gate Location Optimization of Injection Molding Based on Warpage

面向翘曲变形的注塑模具浇口位置优化研究

Preparation and Properties of Glass Fiber Reinforced PET with Low Warpage

低翘曲玻纤增强PET复合材料的制备和性能研究

Research on Injection Molding Simulation and Warpage Compensation of Automotive Fan

汽车风扇注塑成型及变形预补偿的研究

Research on Warpage of nylon part prepared by selective laser sintering

选择性激光烧结尼龙制件翘曲研究

Adjusting delay time and gas pressure can reduce the warpage of the part .

工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。

Research of Residual Stresses and Warpage of Plastic Injection Molding Based on Surface Model

基于表面模型的塑料注射成型残余应力与翘曲变形研究

CAE analysis of the effect of process parameter on Warpage of injection molding part

工艺参数对注塑制品翘曲影响的CAE分析

Nonlinear finite element analysis on electronic chip package warpage

芯片电子封装翘曲非线性有限元分析

Quality optimization and analysis of warpage of injection molding parts based on small the best characteristic

基于望小特性的注塑产品翘曲质量优选及分析

Effects of process parameters on the warpage of gas assisted injection molded part

工艺参数对气辅注射制品翘曲的影响

Based on the experiment results , two kinds of main forms of warpage deformation are presented .

通过试验现象，对翘曲变形的两种主要形式进行了说明。

It has improved surface aesthetics , excellent dimensional stability and low warpage characteristics .

它改善了耐冲击性和良好的加工特性。

Error Analysis of Finite Element Numerical Simulation in the Warpage of Injection Molded Parts

注塑制品翘曲变形有限元数值模拟的误差分析

Finite element simulation analysis on warpage after solidifying process of PBGA

PBGA固化后产生翘曲的有限元模拟分析

Numerical Simulation for Electronic Package Warpage due to Geometrical Dimension

电子封装中材料的几何尺寸对翘曲的影响

Warpage at High Temperature and Mechanical Strength of Silicon Wafers

硅片高温翘曲与常温机械强度

It was found that processing conditions have different effects on the shrinkage and warpage .

研究发现工艺条件对制品的收缩、翘曲、屈曲有着不同的影响规律。

Research of Viscoelastic Warpage Analysis of Surface Mount Package

对表面安装封装体的粘弹性翘曲问题的分析

Application of CAE Technique in analysis of warpage deformation of thin-wall plastic parts

CAE技术在薄壳注塑件翘曲变形分析中的应用

Warpage Analysis and Numerical Prediction of Molding Dimensions for Injection Molded Parts

注塑件的翘曲变形分析与成形尺寸预测

Simulation on curing warpage deformation of composite T-shaped integrated structure

复合材料T型整体化结构固化翘曲变形模拟

CAE Analysis of Warpage Deflection for Battery Cover of Mobile Phone

手机电池盖的CAE翘曲变形分析

Affecting factors of shrinkage and warpage of thin-wall injection molding process

注射成型薄壁制品收缩与翘曲因素

Study on the interlaminar stress and warpage deformation in laminated object manufacturing

分层实体制造中层间应力和翘曲变形的研究

The speckle projection correlation technique is used to measure the chip warpage .

本文采用投影散斑相关法对芯片翘曲度进行了测量。

Influences of Gas Control Parameters on Warpage of Gas-Assisted Injection Molded Parts

气体控制参数对气体辅助成型产品翘曲的影响

Warpage of Parts : Uneven surface temperature of the molds .

变形：不均匀的模具表面温度。

According to the statistical results , the injection time is the most important affecting factor on warpage .

结果表明，注射时间对注塑件翘曲变形的影响最大。