化学镀锡液

从化学镀锡液的基本组成、工艺特点、反应过程及应用等几方面简述了近年来化学镀锡在印刷线路板制备中的研究进展。

The compositions and controlling conditions of the bath , depositing mechanism and applications of electroless tin in fabrication of printed circuit boards in recent years are reviewed .

并对现有的镀液分析方法进行了比较，确定了快速连续测定化学镀锡液中亚锡离子和次磷酸钠的方法。

The existing bath analyzing methods are compared , as a result a quick and continous method for determining sodium hypophosphite and stannum ( II ) ion in electroless tin bath is determined .

通过对化学镀锡液组成的调试和完善，研究了新的工艺配方中工艺条件对沉积速度和镀层中锡含量的影响，优化了化学镀锡的最佳工艺。

The effects of process conditions on deposition rate and tin content of the coatings are studied by adjusting and improving the bath compositions so that the process conditions of electroless tin plating are optimized .

介绍了现阶段化学镀锡工艺的优点及硫酸盐体系与烷基磺酸盐体系2种化学镀锡液的组成。

The advantages of electroless tin plating process at the present stage and the composition of two kinds of electroless plating bath of sulfate system and alkyl sulfate system were introduced .